CMP pad having a streamlined windowpane
View Patent ↗A chemical mechanical polishing pad ( 200, 300, 400, 500, 600 ) that includes a translucent windowpane ( 220, 320, 404, 516, 524, 604 ) that allows optical measurements to be made using light energy reflected from the surface of a wafer ( 212, 324, 608 ) or other object being polished. The windowpane includes a trailing end ( 350, 416, 632 ) and a leading end ( 348, 412, 628 ) each having a streamlined shape so as to reduce the disturbance to the flow of a polishing medium ( 216 ) around the windowpane. The polishing pad may further include grooves ( 336, 428, 520, 640 ) that are diverted around the windowpane so as to provide a continuous path for the polishing medium in the region of the windowpane.
1. A polishing pad suitable for polishing at least one of magnetic, optical and semiconductor substrates, the polishing pad comprising:
(a) a body having a polishing surface and a back surface spaced from the polishing surface wherein the polishing surface includes a plurality of grooves, at least some of the grooves being diverted around the window; and
(b) a window, extending through the body, comprising a translucent windowpane having a surface flush with the polishing surface and having a half-width leading angle of 5 to 150° and a half-width trailing angle of 5 to 45°.
2. The polishing pad according to claim 1 , wherein the window further has a half-width leading angle less than 60°.
3. The polishing pad according to claim 1 , wherein the half-width trailing angle is 10 to 40°.
4. The polishing pad according to claim 1 , wherein the half-width trailing angle is 15 to 30°.
5. A polishing pad suitable for polishing at least one of magnetic, optical and semiconductor substrates, the polishing pad comprising:
(a) a body having a polishing surface and a back surface spaced from the polishing surface, the polishing surface comprising a plurality of grooves; and
(b) a window, extending through the body, comprising a translucent windowpane having a surface flush with the polishing surface;
wherein at least some of the plurality of grooves divert around the window.
6. The polishing pad according to claim 5 , wherein diverted ones of the plurality of grooves are circular except in a region where the diverted ones are diverted.
7. The polishing pad according to claim 5 , wherein diverted ones of the plurality of grooves are linear except in a region wherein the diverted ones are diverted.
8. The polishing pad according to claim 5 , wherein the plurality of grooves define a plurality of like-shaped land regions, the window occupying a plurality of contiguous ones of the plurality of like-shaped land regions.
9. A polishing pad suitable for polishing at least one of magnetic, optical and semiconductor substrates, the polishing pad comprising:
(a) a body having a polishing surface and a back surface spaced from the polishing surface, the polishing surface comprising a plurality of grooves; and
(b) a window, extending through the body, comprising a translucent windowpane having a surface flush with the polishing surface and having a half-width trailing angle of 5 to 45°;
wherein at least some of the plurality of grooves are diverted around the window.