IP Library Granted Patent US 7,435,364
Granted Patent B2
US 7,435,364 · App. 11/398,265 · Granted Oct 14, 2008

Method for forming a porous polishing pad

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Quick Facts
Patent No.
US 7,435,364
App. No.
11/398,265
Granted
Oct 14, 2008
Kind
B2
Abstract

The present invention provides a method of forming a chemical mechanical polishing pad comprising providing a polymeric matrix with fluid-filled unexpanded microspheres, curing the polymeric matrix and heating the polymeric matrix and the microspheres to expand the microspheres.

Claims (35)

1. A method of forming a chemical mechanical polishing pad, comprising:

providing a tank with polymeric materials;

providing a storage silo with unexpanded microspheres;

providing an isocyanate storage tank with isocyanates;

providing a premix prep tank for forming a pre-mixture of the polymeric materials and the unexpanded microspheres;

providing a recirculation loop on the premix prep tank for controlling a bulk density of the pre-mixture in the premix prep tank;

providing an in-line densitometer in the recirculation loop for measuring the bulk density of the pre-mixture;

providing a premix run tank for storing the pre-mixture;

providing a mixer for forming a mixture of the pre-mixture and the isocyanates;

providing a closed mold for molding the mixture;

delivering the polymeric materials and the unexpanded microspheres to the premix prep tank forming a pre-mixture of the polymeric materials and the unexpanded microspheres;

recirculating the pre-mixture through the recirculation loop on the premix tank and adding polymeric materials or unexpanded microspheres to obtain a desired bulk density;

delivering the pre-mixture having the desired bulk density to the premix run tank;

delivering the pre-mixture having the desired bulk density and the isocyanates to the mixer forming a mixture of the pre-mixture and the isocyanates;

injecting the mixture into the closed mold;

curing the mixture to form a molded product; and

expanding the unexpanded microspheres in the molded product to form a polishing pad.

2. The method of claim 1 wherein the unexpanded microspheres comprise polyvinyl alcohols, pectin, polyvinyl pyrrolidone, hydroxyethylcellulose, methylcellulose, hydropropylmethylcellulose, carboxymethylcellulose, hydroxypropylcellulose, polyacrylic acids, polyacrylamides, polyethylene glycols, polyhydroxyetheracrylites, starches, maleic acid copolymers, polyethylene oxide, polyurethanes, cyclodextrin, polyacrylonitrile, polyvinylidene chloride, copolymers of acrylonitrile and vinylidene chloride and combinations thereof.

3. The method of claim 1 wherein the polymeric materials comprise polytetramethylene ether glycol, polyethylene propylene glycol, polyoxypropylene glycol, polyethylene adipate glycol, polybutylene adipate glycol, polyethylene propylene adipate glycol, o-phthalate-1,6-hexanediol, poly(hexamethylene adipate) glycol, 1,6-hexanediol-initiated polycaprolactone, diethylene glycol initiated polycaprolactone, trimethylol propane initiated polycaprolactone, neopentyl glycol initiated polycaprolactone, 1,4-butanediol-initiated polycaprolactone, PTMEG-initiated polycaprolactone, polyphthalate carbonate, poly(hexamethylene carbonate) glycol, diethyl toluene diamine (“DETDA”), 3,5-dimethylthio-2,4-toluenediamine and isomers thereof, 3,5-diethyltoluene-2,4-diamine and isomers thereof, such as 3,5-diethyltoluene-2,6-diamine, 4,4′-bis-(sec-butylamino)-diphenylmethane, 1,4-bis-(sec-butylamino)-benzene, 4,4′-methylene-bis-(2-chloroaniline), 4,4′-methylene-bis-(3-chloro-2,6-diethylaniline) (“MCDEA”), polytetramethyleneoxide-di-p-aminobenzoate, N,N′-dialkyldiamino diphenyl methane, p,p′-methylene dianiline (“MDA”), m-phenylenediamine (“MPDA”), methylene-bis 2-chloroaniline (“MBOCA”), 4,4′-methylene-bis-(2-chloroaniline) (“MOCA”), 4,4′-methylene-bis-(2,6-diethylaniline) (“MDEA”), 4,4′-methylene-bis-(2,3-dichloroaniline) (“MDCA”), 4,4′-diamino-3,3′-diethyl-5,5′-dimethyl diphenylmethane, 2,2′,3,3′-tetrachloro diamino diphenylmethane, trimethylene glycol di-p-aminobenzoate, and blends thereof.

4. The method of claim 1 wherein the isocyanates comprise, methylene bis 4,4′ cyclohexylisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, propylene-1,2-diisocyanate, tetramethylene-1,4-diisocyanate, 1,6-hexamethylene-diisocyanate, dodecane-1,12-diisocyanate, cyclobutane-1,3-diisocyanate, cyclohexane-1,3-diisocyanate, cyclohexane-1,4- diisocyanate, 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethylcyclohexane, methyl cyclohexylene diisocyanate, triisocyanate of hexamethylene diisocyanate, triisocyanate of 2,4,4-trimethyl-1,6-hexane diisocyanate, uretdione of hexamethylene diisocyanate, ethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, dicyclohexylmethane diisocyanate, toluene diisocyanate (TDI), TDI prepolymer, methylene diphenyl diisocyanate (MDI), crude MDI, polymeric MDI, urethodione-modified MDI, carbodimide-modified MDI, and mixtures thereof.

5. A method of forming a chemical mechanical polishing pad, comprising:

providing a polyol storage tank with polymeric materials;

providing a storage silo with unexpanded microspheres;

providing an isocyanate storage tank with isocyanates;

providing a premix run/prep tank for forming a pre-mixture of the polymeric materials and the unexpanded microspheres;

providing a recirculation loop on the premix run/prep tank for controlling a bulk density of the pre-mixture in the premix run/prep tank;

providing an in-line densitometer in the recirculation loop for measuring the bulk density of the pre-mixture;

providing a mixer for forming a mixture of the pre-mixture and the isocyanates;

providing a closed mold for molding the mixture;

delivering the polymeric materials and the unexpanded microspheres to the premix run/prep tank forming a pre-mixture of the polymeric materials and the unexpanded microspheres;

recirculating the pre-mixture through the recirculation loop on the premix run/prep tank until the desired bulk density is reached;

delivering the pre-mixture having the desired bulk density and the curing agents to the mixer forming a mixture of the pre-mixture and the isocyanates;

injecting the mixture into the closed mold;

curing the mixture in the closed mold to form a molded product; and

expanding the unexpanded microspheres in the molded product to form the polishing pad.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →