IP Library Granted Patent US 9,018,273
Granted Patent B2
US 9,018,273 · App. 13/635,883 · Granted Apr 28, 2015

Polishing pad and production method therefor, and production method for semiconductor device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,018,273
App. No.
13/635,883
Granted
Apr 28, 2015
Kind
B2
Abstract

A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

Claims (6)

1. A polishing pad, having a polishing layer comprising a thermoset polyurethane foam,

wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer,

the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and

the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

2. The polishing pad according to claim 1 , wherein the active-hydrogen-containing compounds comprise a bifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 1,000 to 1,500 mg KOH/g in an amount of 0 to 20 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

3. The polishing pad according to claim 1 , wherein the thermoset polyurethane foam has substantially spherical bubbles having an average bubble diameter of 20 to 300 μm.

Assignments (5)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 038053/0218 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2012
From: ITO, AYA; DOURA, MASATO
To: TOYO TIRE & RUBBER CO., LTD.
Reel/Frame 029073/0853 →