An object of the present invention is to provide a polishing pad which enables high accuracy optical end-point detection in a state where polishing is carrying out, and which can prevent slurry leakage from a polishing layer to a cushion layer even in the case of being used for a long period. Another object is to provide a method for producing a semiconductor device using the polishing pad. The present invention relates to a polishing pad in which a polishing layer having a polishing region and a light-transmitting region, and a cushion layer having a through hole are laminated via a double-sided adhesive sheet such that the light-transmitting region and the through hole are laid one upon another, wherein a transparent member is stuck on an adhesive layer of the double-sided adhesive sheet in the through hole.
1. A polishing pad in which a polishing layer having a polishing region and a light-transmitting region, and a cushion layer having a through hole are laminated via a double-sided adhesive sheet having a transparent sheet and upper and lower adhesive layers formed on both surfaces of the transparent sheet, respectively, such that the light-transmitting region and the through hole are laid one upon another, said light-transmitting region being a window formed in the polishing layer, surrounded by the polishing region, and being constituted by a light-transmitting resin attached to an upper face of the upper adhesive layer of the double-sided adhesive sheet, wherein a transparent member is stuck on a lower face of the lower adhesive layer, inside the through hole formed in the cushion layer, opposite to an upper face of the lower adhesive layer adhering to the transparent sheet.
2. The polishing pad according to claim 1 , wherein the transparent member is a resin film subjected to an anti-reflection treatment and/or a light scattering treatment.
3. The polishing pad according to claim 1 , wherein the transparent member is a resin film subjected to an anti-fouling treatment.
4. The polishing pad according to claim 1 , wherein the transparent member is a resin film having a bandpass function.
5. A method for producing a semiconductor device, comprising the step of polishing a surface of a semiconductor wafer using the polishing pad according to claim 1 .