POLISHING PAD FORMED FROM DUAL CURATIVE
A chemical mechanical polishing pad comprising a polishing layer which comprises a reaction product of an isocyanate terminated urethane prepolymer; and a curative system comprising a sulfur containing diamine curative, and a high molecular weight polyol curative, wherein the high molecular weight polyol curative can have reduced polishing defects. The high molecular weight polyol curative has a number average molecular weight of 2,500 to 100,000; and an average of 3 to 10 hydroxyl groups per molecule. The weight ratio of the high molecular weight polyol curative to the sulfur containing diamine curative is in the range of 3:10 to 7:10.
1 . A chemical mechanical polishing pad comprising a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of an isocyanate terminated urethane prepolymer; and a curative system comprising
(a) a sulfur containing diamine curative, and
(b) a high molecular weight polyol curative, wherein the high molecular weight polyol curative has a number average molecular weight, Mn, of 2,500 to 100,000; and wherein the high molecular weight polyol curative has an average of 3 to 10 hydroxyl groups per molecule;
wherein the weight ratio of the high molecular weight polyol curative to the sulfur containing diamine curative is in the range of 3:10 to 7:10.
2 . The chemical mechanical polishing pad of claim 1 wherein the sulfur containing diamine curative comprises diamine functional aromatic compound having one or more alkylthio group pendant from an aromatic ring.
3 . The chemical mechanical polishing pad of claim 2 wherein the sulfur containing diamine curative comprises dialkylthiotoluenediamine, monoalkylthiotoluenediamine, or both, in each case where the alkyl group comprises 1, 2, or 3 carbon atoms.
4 . The chemical mechanical polishing pad of claim 1 wherein the sulfur containing diamine curative comprises at least 95 weight percent based on total weight of the diamine curative of dimethylthiotoluenediamine.
5 . The chemical mechanical polishing pad of claim 1 wherein the weight ratio of the high molecular weight polyol curative to the sulfur containing diamine is in the range of 4:10 to 5:10.
6 . The chemical mechanical polishing pad of claim 1 wherein the isocyanate terminated urethane prepolymer has 8.3 to 9.8 wt % unreacted NCO groups.
7 . The chemical mechanical polishing pad of claim 1 wherein the curative system has a plurality of reactive hydrogen groups and the isocyanate terminated urethane prepolymer has a plurality of unreacted NCO groups; and, wherein a stoichiometric ratio of the reactive hydrogen groups to the unreacted NCO groups is 0.85 to 1.15.
8 . The chemical mechanical polishing pad of claim 1 wherein the polishing layer has a density of 0.7 to 1.1 g/cubic centimeter as determined by actual weight divided by its actual volume.
9 . The chemical mechanical polishing pad of claim 1 wherein polishing layer comprises expanded polymeric microspheres.
10 . The chemical mechanical polishing pad of claim 1 wherein polishing surface comprises a groove in a pattern of concentric circles, radial, or a combination thereof.