Low-defect-porous polishing pad
View Patent ↗The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates with a polishing fluid and relative motion between the polishing pad and the at least one of semiconductor, optical and magnetic substrates. The polishing layer has an open-cell polymeric matrix, a polishing surface, a plurality of grooves in the polishing layer. The plurality of projecting land areas are buttressed with a tapered support structure that extends outward and downward from the bottom plurality of projecting land areas. The plurality of projecting land areas have an average width less than average width of the plurality of grooves for decreasing polishing dwell time of the projecting land areas and increasing the debris removal dwell time of the groove areas to a value greater than the polishing dwell time.
1. A polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates with a polishing fluid and relative motion between the polishing pad and the at least one of semiconductor, optical and magnetic substrates, the polishing pad comprising the following:
a polishing layer having an open-cell polymeric matrix, a polishing surface and a thickness, the open-cell polymeric matrix having vertical pores and open channels interconnecting the vertical pores;
a plurality of grooves in the polishing layer, the grooves having an average width measured adjacent a polishing surface, the plurality of grooves having a debris removal dwell time where a point on the at least one of semiconductor, optical and magnetic substrates rotated at a fixed rate passes over the width of the plurality of grooves, the grooves having a width measured at the polishing surface; and
a plurality of projecting land areas being pillows within the plurality of grooves, the pillows being buttressed with a tapered support structure that extends outward and downward from a top of the pillows, the pillows having a frusta or non-pointed top that forms the polishing surface from the polymer matrix containing the vertical pores, the pillows having a width measured at the polishing surface and a polishing dwell time where a point on the at least one of semiconductor, optical and magnetic substrates rotated at the fixed rate passes over the plurality of projecting land areas adjacent the plurality of grooves, the pillows having an average width less than an average width of the plurality of grooves for decreasing polishing dwell time of the pillows and increasing the debris removal dwell time of the groove areas to a value greater than the polishing dwell time.
2. The polishing pad of claim 1 wherein the vertical pores have an average height and the plurality of grooves have an average depth greater than the average height of the vertical pores.
3. The polishing pad of claim 1 wherein the vertical pores have an average diameter that increases below the polishing surface.
4. The polishing pad of claim 1 wherein the pillows have a shape selected from hemispherical, frusta-pyramidal, frusta-trapezoidal and combinations thereof with the plurality of grooves extending between the pillows in a linear manner.
5. The polishing pad of claim 1 wherein plurality of grooves form an orthogonal grid pattern.
6. A polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates with a polishing fluid and relative motion between the polishing pad and the at least one of semiconductor, optical and magnetic substrates, the polishing pad comprising the following:
a polishing layer having an open-cell polymeric matrix, a polishing surface and a thickness, the open-cell polymeric matrix having vertical pores and open channels interconnecting the vertical pores;
a plurality of grooves in the polishing layer, the grooves having an average width measured adjacent a polishing surface, the plurality of grooves having a debris removal dwell time where a point on the at least one of semiconductor, optical and magnetic substrates rotated at a fixed rate passes over the width of the plurality of grooves, the grooves having a width measured at the polishing surface; and
a plurality of projecting land areas being pillows within the plurality of grooves, the pillows being buttressed with a tapered support structure that extends outward and downward from a top of the plurality of the pillows at a slope of 30 to 60 degrees as measured from a plane of the polishing surface, the pillows having a width measured at the polishing surface and a frusta or non-pointed top that forms the polishing surface from the polymer matrix containing the vertical pores, the plurality of projecting land areas having a polishing dwell time where a point on the at least one of semiconductor, optical and magnetic substrates rotated at the fixed rate passes over the plurality of projecting land areas adjacent the plurality of grooves, the pillows having an average width less than an average width of the plurality of grooves for decreasing polishing dwell time of the pillows and increasing the debris removal dwell time of the groove areas to a value greater than the polishing dwell time.
7. The polishing pad of claim 6 wherein the vertical pores have an average height and the plurality of grooves have an average depth greater than the average height of the vertical pores.
8. The polishing pad of claim 6 wherein the vertical pores have an average diameter that increases below the polishing surface.
9. The polishing pad of claim 6 wherein the pillows have a shape selected from hemispherical, frusta-pyramidal, frusta-trapezoidal and combinations thereof with the plurality of grooves extending between the pillows in a linear manner.
10. The polishing pad of claim 6 wherein plurality of grooves form an orthogonal grid pattern.