IP Library Granted Patent US 12,447,581
Granted Patent B2
US 12,447,581 · App. 17/811,624 · Granted Oct 21, 2025

Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features

Inventors: Bainian Qian (Newark, DE); Donna M. Alden (Bear, DE); Sheng-Huan Tseng (Zhubei, TW)
Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
B24B37/22B24B37/24B24D3/00
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Quick Facts
Patent No.
US 12,447,581
App. No.
17/811,624
Granted
Oct 21, 2025
Kind
B2
Abstract

A polishing pad for chemical mechanical polishing comprises a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate terminated prepolymer with a curative, wherein the polymer matrix has hard segments and soft segments wherein multi-lobed polymeric elements formed from pre-expanded polymeric microspheres are present in the polymer matrix. The polishing pad can be made by preparing a pre-blend of the isocyanate terminated prepolymer and the pre-expanded fluid filled polymeric microspheres in a stirred tank; pumping a portion of the pre-blend from a bottom of the stirred tank through a conduit and recycling to a top region of the stirred tank, mixing a portion of the pre-blend with the curative to form a mixture, casting the mixture in a mold, curing the mixture in the mold.

Claims (15)

1. A polishing pad for chemical mechanical polishing comprising:

a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate terminated prepolymer with a curative, wherein the polymer matrix has hard segments and soft segments wherein multi-lobed polymeric elements formed from pre-expanded polymeric microspheres are present in the polymer matrix and wherein the multi-lobed polymeric elements are deflated residues of the pre-expanded polymeric microspheres and wherein the polishing layer further comprises pores formed by a portion of the pre-expanded polymeric microspheres that retain a shape that is substantially spherical or ellipsoid and 0.1 to 20 percent of the pre-expanded polymeric microspheres form the multi-lobed polymeric elements.

2. The polishing pad of claim 1 wherein the multi-lobed polymeric elements comprise three or more lobes.

3. The polishing pad of claim 1 wherein at least a portion of the deflated residues of the pre-expanded polymeric microspheres comprise a residual irregular void space.

4. The polishing pad of claim 1 wherein at least a portion of the lobes of the multi-lobed polymeric elements comprise plate-like protrusions that project from a central region.

5. The polishing pad of claim 1 wherein the pre-expand led polymeric microspheres specific gravity of 0.06 to 0.096.

6. The polishing pad of claim 1 wherein the pre-expanded polymeric microspheres comprise a polymeric shell having a chlorine content less than 0.1 wt % based on total weight of the polymeric shell around a fluid filled core, where the fluid comprises a gas.

7. The polishing pad of claim 1 wherein the deflated residues of the pre-expanded polymeric microspheres do not include holes or tears when examined under scanning electron microscope at 50× magnification.

8. A method of making the polishing pad of claim 1 comprising

preparing a pre-blend of the isocyanate terminated prepolymer and the pre-expanded fluid filled polymeric microspheres in a stirred tank,

pumping a portion of the pre-blend from a bottom of the stirred tank through a conduit and recycling to a top region of the stirred tank,

mixing a portion of the pre-blend with the curative to form a mixture,

casting the mixture in a mold, and

curing the mixture in the mold.

9. A method of polishing comprising providing a substrate comprising a metal, a metal oxide, or both, and polishing the substrate using the polishing pad of claim 1 .

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2022
From: QIAN, BAINIAN; ALDEN, DONNA M.; TSENG, SHENG-HUAN
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLIDNGS, INC.
Reel/Frame 060908/0256 →