IP Library Granted Patent US 8,602,846
Granted Patent B2
US 8,602,846 · App. 13/552,346 · Granted Dec 10, 2013

Polishing pad and a method for manufacturing the same

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Quick Facts
Patent No.
US 8,602,846
App. No.
13/552,346
Granted
Dec 10, 2013
Kind
B2
Abstract

A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 μm. The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.

Claims (3)

1. A method for manufacturing a polishing pad, comprising steps of preparing a cell-dispersed urethane composition by mechanical foaming method, coating a sheet A having a nitrogen gas permeability rate of 1×10 −7 [cm 3 /cm 2 ·s·cmHg] or less with the cell-dispersed urethane composition, laminating a sheet B having a nitrogen gas permeability rate of 1×10 −7 [cm 3 /cm 2 ·s·cmHg] or less on the coated cell-dispersed urethane composition, and curing the cell-dispersed urethane composition while keeping the thickness thereof uniform with a pressing means to form a thermosetting polyurethane foam layer with interconnected cells.

2. The method for manufacturing a polishing pad according to claim 1 , wherein the curing step comprises at least primary curing and secondary curing, the primary curing is at a curing temperature of 30 to 50° C. for a curing time of 5 to 60 minutes, and the secondary curing is at a curing temperature of 60 to 80° C. for a curing time of 30 minutes or more.

3. The method for manufacturing a polishing pad according to claim 1 , wherein the sheets A and B are polyethylene terephthalate sheets respectively.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 038053/0638 →