Polishing pad and method for producing same
View Patent ↗An object of the invention is to provide a polishing pad that achieves a high polishing rate and has high thickness precision so that the break-in time (dummy polishing time) can be shortened, and to provide a method for producing same. The invention is directed to a polishing pad including a base material layer and a polishing layer provided on the base material layer, wherein the polishing layer includes a thermoset polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 200 μm, and the polishing layer has a storage modulus E′ (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (60° C.) at 60° C. [E′(30° C.)/E′(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (90° C.) at 90° C. [E′(30° C.)/E′(90° C.)] of 15 to 130.
1. A polishing pad, comprising a base material layer and a polishing layer provided on the base material layer, wherein
the polishing layer comprises a thermoset polyurethane foam having roughly spherical interconnected hollow cells with an average cell diameter of 35 to 200 μm, and
the polishing layer has a storage modulus E′ (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (60° C.) at 60° C. [E′(30° C.)/E′(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (90° C.) at 90° C. [E′(30° C.)/E′(90° C.)] of 15 to 130.
2. The polishing pad according to claim 1 , wherein the thermoset polyurethane foam is a product of reaction and curing of a urethane composition containing an isocyanate component and active hydrogen-containing compounds, wherein the active hydrogen-containing compounds comprise 35 to 90% by weight of a trifunctional polyol with a hydroxyl value of 150 to 400 mgKOH/g and/or a tetrafunctional polyol with a hydroxyl value of 150 to 400 mgKOH/g.
3. The polishing pad according to claim 2 , wherein the active hydrogen-containing compounds further comprise 10 to 50% by weight of a bifunctional polyol with a hydroxyl value of 30 to 150 mgKOH/g.
4. The polishing pad according to claim 1 , wherein the polishing layer is self-bonded to the base material layer.
5. The polishing pad according to claim 1 , wherein the ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (90° C.) at 90° C. [E′(30° C.)/E′(90° C.)] is 24 to 130.
6. A method for producing a polishing pad, comprising the steps of:
preparing, by a mechanical foaming method, a cell dispersed urethane composition which contains an isocyanate component, active hydrogen-containing compounds comprising 35 to 90% by weight of a trifunctional polyol with a hydroxyl value of 150 to 400 mgKOH/g and/or a tetrafunctional polyol with a hydroxyl value of 150 to 400 mgKOH/g, and a silicone surfactant;
applying the cell dispersed urethane composition to a base material layer;
curing the cell dispersed urethane composition to form a thermoset polyurethane foam having roughly spherical interconnected hollow cells with an average cell diameter of 35 to 200 μm; and
uniformly controlling the thickness of the thermoset polyurethane foam to form a polishing layer, wherein
the polishing layer has a storage modulus E′ (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (60° C.) at 60° C. [E′(30° C.)/E′(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (90° C.) at 90° C. [E′(30° C.)/E′(90° C.)] of 15 to 130.
7. A method for producing a polishing pad, comprising the steps of:
preparing, by a mechanical foaming method, a cell dispersed urethane composition which contains an isocyanate component, active hydrogen-containing compounds comprising 35 to 90% by weight of a trifunctional polyol with a hydroxyl value of 150 to 400 mgKOH/g and/or a tetrafunctional polyol with a hydroxyl value of 150 to 400 mgKOH/g, and a silicone surfactant;
applying the cell dispersed urethane composition to a release sheet;
placing a base material layer on the cell dispersed urethane composition;
curing the cell dispersed urethane composition, while making a uniform thickness by pressing means, so that a thermoset polyurethane foam having roughly spherical interconnected hollow cells with an average cell diameter of 35 to 200 μm is formed;
peeling off the release sheet under the thermoset polyurethane foam; and
removing a skin layer from an exposed surface of the thermoset polyurethane foam, wherein
the polishing layer has a storage modulus E′ (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (60° C.) at 60° C. [E′(30° C.)/E′(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E′ (30° C.) at 30° C. to storage modulus E′ (90° C.) at 90° C. [E′(30° C.)/E′(90° C.)] of 15 to 130.