IP Library Granted Patent US 8,585,885
Granted Patent B2
US 8,585,885 · App. 12/229,746 · Granted Nov 19, 2013

Electrochemically deposited indium composites

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Quick Facts
Patent No.
US 8,585,885
App. No.
12/229,746
Granted
Nov 19, 2013
Kind
B2
Abstract

Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Claims (13)

1. A method comprising:

a) providing a composition consisting of one or more sources of indium ions, one or more epihalohydrin copolymers consisting of polymerization products of one or more epihalohydrins and one or more nitrogen-containing organic compounds, the one or more epihalohydrin copolymers are in amounts of 5-100 g/L, one or more ceramic materials, water, and optionally one or more additives selected from the group consisting of silicone dispersants, polyalkoxylated ethers, glycol ethers, buffers, conducting salts, chelating agents, levelers and carriers; and

b) electrochemically depositing a composite comprising indium and the one or more ceramic materials on a substrate.

2. The method of claim 1 , wherein the current density ranges from 0.5 A/dm 2 to 50 A/dm 2 .

3. The method of claim 1 , wherein the nitrogen-containing organic compounds are chosen from aliphatic chain amines, unsubstituted heterocyclic nitrogen compounds having at least two reactive nitrogen sites, and substituted heterocyclic nitrogen compounds having at least two reactive nitrogen sites and having 1-2 substitution groups chosen from alkyl groups, aryl groups, nitro groups, halogens and amino groups.

4. The method of claim 1 , wherein the one or more ceramic materials are chosen from diamond, graphite, ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic silicides and intermetallics.

5. A method comprising:

a) providing a composition consisting of one or more sources of indium ions, one or more epihalohydrin copolymers consisting of polymerization products of one or more epihalohydrins and one or more unsubstituted heterocyclic nitrogen compounds having at least two reactive nitrogen sites and substituted heterocyclic nitrogen compounds having at least two reactive nitrogen sites and having 1-2 substitution groups chosen from alkyl groups, aryl groups, nitro groups, halogens and amino groups, the one or more epihalohydrin copolymers are in amounts of 5-100 g/L, one or more ceramic materials, water, and optionally one or more additives selected from the group consisting of silicone dispersants, polyalkoxylated ethers, glycol ethers, buffers, conducting salts, chelating agents, levelers and carriers; and

b) electrochemically depositing a composite comprising indium and the one or more ceramic materials on a substrate.

6. The method of claim 3 , wherein the unsubstituted heterocyclic nitrogen compounds having at least two reactive nitrogen sites are chosen from imidazole, imidazoline, pyrazole, 1,2,3-triazole, tetrazole, pyradazine, 1,2,4-triazole, 1,2,3-oxadiazole, 1,2,4-thiadiazole and 1,3,4-thiadiazole.

7. The method of claim 3 , wherein the substituted heterocyclic nitrogen compounds having at least two reactive nitrogen sites and having 1-2 substitution groups are chosen from benzimidazole, 1-methylimidazole, 2-methylimidazole, 1,3-dimethylimidazole, 4-hydroxy-2-amino imidazole, 5-ethyl-4-hydroxyimidazole, 2-phenylimidazole and 2-tolylimidazoline.

8. The method of claim 1 , wherein the one or more sources of indium ions are in amounts of 10 g/L to 70 g/L.

9. The method of claim 1 , wherein pH is from 0 to 5.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →