Patent Assignment
Reel/Frame 069272/0383
Change of Name
Recorded: 2024-10-29
Pages: 14
Assignor
ROHM & HAAS ELECTRONIC MATERIALS LLC
Executed: 2024-04-01
Assignee
DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
455 FOREST STREET, MARLBOROUGH, MASSACHUSETTS, 01752
Covered Properties
(403)
Polyimide-Polyarylene Polymers
Anti-Reflective Coating
Tunable Refractive Index Polymers
Optically Clear Shear Thickening Fluids and Optical Display Device Comprising Same
High Refractive Index Materials
Application:
17/411,708 →
Publication:
US US20220112321A1
Bisbenzocyclobutene Formulations
Application:
17/337,980 →
Publication:
US US20220002474A1
High Refractive Index Materials
Application:
18/482,295 →
Publication:
US US20240152047A1
Selenium Ink and Methods of Making and Using Same
Dichalcogenide Selenium Ink and Methods of Making and Using Same
Dichalcogenide Selenium Ink and Methods of Making and Using Same
Selenium/group 1B ink and methods of making and using same
Selenium/Group 1B Ink and Methods of Making and Using Same
Group 3a ink and methods of making and using same
Plating Bath and Method
Plating Bath and Method
Plating Bath and Method
Plating Bath and Method
Plating Bath and Method
Copper Electroplating Solution and Method of Copper Electroplating
Patent:
9,637,833 →
Application:
13/726,251 →
Plating Catalyst and Method
Copper Electroplating Solution and Method of Copper Electroplating
Plating Catalyst and Method
Method of Removing Negative Acting Photoresists
Electrolytic Copper Plating Solution and Method of Electrolytic Copper Plating
Electrolytic Copper Plating Liquid and the Electrolytic Copper Plating Method
Amino Sulfonic Acid Based Polymers for Copper Electroplating
Amino Sulfonic Acid Based Polymers for Copper Electroplating
Chrome-Free Methods of Etching Organic Polymers
Patent:
8,603,352 →
Application:
13/659,937 →
Sulfonamide Based Polymers for Copper Electroplating
Sulfonamide Based Polymers for Copper Electroplating
Chrome-Free Methods of Etching Organic Polymers with Mixed Acid Solutions
Hot Melt Compositions with Improved Etch Resistance
Hot Melt Compositions with Improved Etch Resistance
Hot Melt Compositions with Improved Etch Resistance
Electroless Metallization of Dielectrics with Alkaline Stable Pyrazine Derivative Containing Catalysts
Copper Electroplating Baths Containing Compounds of Reaction Products of Amines and Polyacrylamides
Additives for Electroplating Baths
Reaction Products of Guanidine Compounds or Salts Thereof, Polyepoxides and Polyhalogens
Reaction Products of Guanidine Compounds or Salts Thereof, Polyepoxides and Polyhalogens
Reaction Products of Guanidine Compounds or Salts Thereof, Polyepoxides and Polyhalogens
Imaging Three Dimensional Substrates Using a Transfer Film
Reaction Products of Heterocyclic Nitrogen Compounds Polyepoxides and Polyhalogens
Reaction Products of Heterocyclic Nitrogen Compounds Polyepoxides and Polyhalogens
Imaging on Substrates with Alkaline Strippable Uv Blocking Compositions and Aqueous Soluble Uv Transparent Films
Imaging on Substrates with Aqueous Alkaline Soluble Uv Blocking Compositions and Aqueous Soluble Uv Transparent Films
Reaction Products of Amino Acids and Epoxies
Reaction Products of Amino Acids and Epoxies
Metallization Inhibitors for Plastisol Coated Plating Tools
Environmentally Friendly Nickel Electroplating Compositions and Methods
Nickel Electroplating Compositions with Cationic Polymers and Methods of Electroplating Nickel
Nickel Electroplating Compositions with Copolymers of Arginine and Bisepoxides and Methods of Electroplating Nickel
Environmentally Friendly Nickel Electroplating Compositions and Methods
Acidic Aqueous Silver-Nickel Alloy Electroplating Compositions and Methods
Acid Aqueous Binary Silver-Bismuth Alloy Electroplating Compositions and Methods
Acidic Aqueous Binary Silver-Bismuth Alloy Electroplating Compositions and Methods
Application:
17/556,037 →
Publication:
US US20220112619A1
Acidic Aqueous Binary Silver-Bismuth Alloy Electroplating Compositions and Methods
Application:
16/708,783 →
Publication:
US US20210172082A1
Method of Inhibiting Tarnish Formation and Corrosion
Method of Inhibiting Tarnish Formation and Corrosion
Application:
17/703,774 →
Publication:
US US20230304180A1
Silver Electroplating Compositions and Methods for Electroplating Silver with Low Coefficients of Friction
Application:
18/153,099 →
Publication:
US US20230160085A1
Silver Electroplating Compositions and Methods for Electroplating Silver with Low Coefficients of Friction
Method for Manufactunring a Multilayer Circuit Structure Having Embedded Trace Layers
Application:
17/529,764 →
Publication:
US US20220201853A1
Method for Manufactunring a Multilayer Circuit Structure Having Embedded Trace Layers
Application:
17/232,784 →
Publication:
US US20220201852A1
Method of Filling Through-Holes to Reduce Voids
Application:
18/162,971 →
Publication:
US US20230279577A1
Waveguide Compositions and Waveguides Formed Therefrom
Optical Component Formation Method
Waveguide Compositions and Waveguides Formed Therefrom
Methods of Forming Printed Circuit Boards
Optical Interface Assembly and Method of Formation
Waveguide Compositions and Waveguides Formed Therefrom
Optical Dry-Films and Methods of Forming Optical Devices with Dry Films
Optical Dry-Films and Methods of Forming Optical Devices with Dry Films
Silicon-Containing Polymers and Polymers and Optical Waveguides Formed Therefrom
Plating Method
Metal Plating Compositions
Metal Plating Compositions
Methods of Forming Printed Circuit Boards Having Optical Functionality
Metal Plating Compositions and Methods
Metal Plating Compositions and Methods
Copper Plating Bath Formulation
Copper Plating Process
Method for Producing Led by One Step Film Lamination
A Method of Manufacturing an Optoelectronic Device
Uv Curable Silicone Composition and an Encapsulant or a Sheet Film Thereof
Uv Curable Silicone Composition and an Encapsulant or a Sheet Film Thereof
Resin Composition
Photoimagable Dielectrics
Application:
18/187,072 →
Publication:
US US20240317940A1
Polymeric Resin for Dielectric Applications
Plating Method
Method of Electroplating Copper into a via on a Substrate from an Acid Copper Electroplating Bath
Copper Electroplating Baths and Electroplating Methods Capable of Electroplating Megasized Photoresist Defined Features
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Pyrazole Compounds and Bisepoxides
Copper Electroplating Compositions and Methods of Electroplating Copper on Substrates
Copper Electroplating Compositions and Methods of Electroplating Copper on Substrates
Copper Electroplating Compositions and Methods of Electroplating Copper on Substrates
Method of Enhancing Copper Electroplating
Method of Enhancing Copper Electroplating
Leveler Compounds
Leveler Compounds
Leveler Compounds
Leveler Compounds
Ephemeral Bonding
Ephemeral Bonding
Ephemeral Bonding
Adhesion Promoter
Adhesion Promoter
Adhesion Promoter
Adhesion Promoter
Methods of Making Stable and Thermally Polymerizable Vinyl, Amino or Oligomeric Phenoxy Benzocyclobutene Monomers with Improved Curing Kinetics
Photosensitive Bismaleimide Composition
Polymeric Resin for Dielectric Applications
Composite Materials for Dielectric Applications
Photosensitive Composition
Photosensitive Composition
Plating Bath and Method
Tin or Tin Alloy Plating Liquid
Indium Electroplating Compositions Containing 1,10-Phenanthroline Compounds and Methods of Electroplating Indium
Patent:
9,809,892 →
Application:
15/212,737 →
Indium Electroplating Compositions Containing Amine Compounds and Methods of Electroplating Indium
Indium Compositions
Indium compositions
Electrochemically Deposited Indium Composites
Electrochemically deposited indium composites
Lead-Free Tin Alloy Electroplating Compositions and Methods
Method of replenishing indium ions in indium electroplating compositions
Method for replenishing tin and its alloying metals in electrolyte solutions
Method of Electroplating Silver Strike Over Nickel
Cyanide-Free Silver Electroplating Solutions
Gold Plating Solution
High Temperature Resistant Silver Coated Substrates
Method of Preventing Silver Tarnishing
Electroplating Baths of Silver and Tin Alloys
Method of Treating Gold or Gold Alloy with a Surface Treatment Solution Comprising a Disulfide Compound
Cyanide-Free Acidic Matte Silver Electroplating Compositions and Methods
Surface Treatment Solutions for Gold and Gold Alloys
Bismuth Electroplating Baths and Methods of Electroplating Bismuth on a Substrate
Methods of Generating Managese (Iii) Ions in Mixed Aqueous Acid Solutions Using Ozone
Press-Fit Terminal with Improved Whisker Inhibition
Silver Electroplating Compositions and Methods for Electroplating Rough Matt Silver
Application:
18/163,467 →
Publication:
US US20240003037A1
Silver Electroplating Compositions and Methods for Electroplating Rough Matt Silver
Patent:
11,629,426 →
Application:
17/852,825 →
Silver Coating for High Temperature Applications
Application:
17/718,941 →
Publication:
US US20230328899A1
Nickel Electroplating Compositions for Rough Nickel
Nickel Electroplating Compositions for Rough Nickel
Catalyst Composition and Deposition Method
Catalyst Composition and Deposition Method
Catalyst Composition and Deposition Method
Electroplating Composite Substrates
Gold Alloy Electrolytes
Gold Alloy Electrolytes
Metallization of Dielectrics
Electroplating Bronze
Acidic Gold Alloy Plating Solution
High Speed Method for Plating Palladium and Palladium Alloys
Anti-Displacement Hard Gold Compositions
Coating Compositions for Use with an Overcoated Photoresist
Patent:
10,481,494 →
Application:
14/635,553 →
Coating Compositions for Use with an Overcoated Photoresist
Coating Compositions for Use with an Overcoated Photoresist
Gap-Fill Methods
Coating Composition for Use with an Overcoated Photoresist
Method for Forming Pattern Using Antireflective Coating Composition Including Photoacid Generator
Coating Composition for Use with an Overcoated Photoresist
Composition for Photoresist Underlayer
Coated Underlayer for Overcoated Photoresist
Photoresist Underlayer Composition
Application:
17/490,816 →
Publication:
US US20230103371A1
Photoresist Underlayer Composition
Application:
18/076,475 →
Publication:
US US20230194990A1
Photoresist Underlayer Composition
Methods of Forming a Semiconductor Device
Application:
63/616,683 →
Coating Compositions for Use with an Overcoated Photoresist
Coating Compositions for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Methods of Forming Photolithographic Patterns
Photoresist Overcoat Compositions and Methods of Forming Electronic Devices
Photoresist Overcoat Compositions and Methods of Forming Electronic Devices
Photoresist Overcoat Compositions and Methods of Forming Electronic Devices
Compositions and Processes for Photolithography
Photolithographic Methods
Photolithographic Methods
Photolithographic Methods
Topcoat Compositions and Photolithographic Methods
Photoresist Pattern Trimming Methods
Photoresist Pattern Trimming Methods
Photoresist Pattern Trimming Methods
Ion Implantation Methods
Ion Implantation Methods
Ionic Thermal Acid Generators for Low Temperature Applications
Photoresist Pattern Trimming Methods
Photoresist Pattern Trimming Compositions and Methods
Topcoat Compositions and Photolithographic Methods
Photolithographic Methods
Pattern Formation Methods
Photoresist Overcoat Compositions
Photoresist Pattern Trimming Compositions and Methods
Thermal Acid Generators and Photoresist Pattern Trimming Compositions and Methods
Pattern Trimming Methods
Pattern Trimming Compositions and Methods
Topcoat Compositions Containing Fluorinated Thermal Acid Generators
Topcoat Compositions Containing Fluorinated Thermal Acid Generators
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Pattern-Formation Methods
Pattern Formation Methods and Photoresist Pattern Overcoat Compositions
Pattern Formation Methods and Photoresist Pattern Overcoat Compositions
Ion Exchange Resins, Purification Methods and Methods of Making Ionic Resins
Acoustic Wave Sensors and Methods of Sensing a Gas-Phase Analyte
Purification Methods
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Containers with Active Surface and Methods of Forming Such Containers
Application:
16/402,485 →
Publication:
US US20190382161A1
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Photoresist Pattern Trimming Compositions and Pattern Formation Methods
Photoresist Compositions and Pattern Formation Methods
Application:
17/564,476 →
Publication:
US US20220214616A1
Photoresist Pattern Trimming Compositions and Methods of Trimming Photoresist Patterns
Application:
17/081,258 →
Publication:
US US20220128906A1
Photoresist Pattern Trimming Compositions and Pattern Formation Methods
Gas Sensors and Methods of Sensing a Gas-Phase Analyte
Photoresist Topcoat Compositions and Pattern Formation Methods
Application:
17/564,462 →
Publication:
US US20220214619A1
Photoresist Topcoat Compositions and Pattern Formation Methods
Application:
18/082,025 →
Publication:
US US20230251575A1
Coated Containers and Methods of Forming Such Containers
Application:
18/107,132 →
Publication:
US US20240217702A1
Stripper for Electronics
Coating Compositions for Photoresists
Coating Compositions for Photoresists
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Photoacid Generators and Photoresists Comprising Same
Photoacid Generators and Photoresists Comprising Same
Novel Polymers and Photoresist Compositions
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Photosensitive Copolymer and Photoresist Composition
Compositions Comprising Base-Reactive Component and Processes for Photolithography
Base Reactive Photoacid Generators and Photoresists Comprising Same
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Lactone Photoacid Generators and Resins and Photoresists Comprising Same
Photoresists and Methods for Use Thereof
Compositions Comprising Base-Reactive Component and Processes for Photolithography
Photoresist and Coated Substrate Comprising Same
Surface Active Additive and Photoresist Composition Comprising Same
Photoacid Generator and Photoresist Comprising Same
Photoacid Generator and Photoresist Comprising Same
Photoresist Composition
Photoacid Generator, Photoresist, Coated Substrate, and Method of Forming an Electronic Device
Photoacid Generator and Photoresist Comprising Same
Cycloaliphatic Monomer, Polymer Comprising the Same, and Photoresist Composition Comprising the Polymer
Photosensitive Copolymer, Photoresist Comprising the Copolymer, and Articles Formed Therefrom
Zwitterionic Photo-Destroyable Quenchers
Acid Generators and Photoresists Comprising Same
Acid Generators and Photoresists Comprising Same
Acid Generators and Photoresists Comprising Same
Photoresists Comprising Amide Component
Dendritic Compounds, Photoresist Compositions and Methods of Making Electronic Devices
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Photoresists Comprising Ionic Compound
Photoacid Generating Compound and Photoresist Composition Comprising Same, Coated Article Comprising the Photoresist and Method of Making an Article
Acid Generator Compounds and Photoresists Comprising Same
Photoresists Comprising Multiple Acid Generator Compounds
Photosensitive Copolymer, Photoresist Comprising the Copolymer, and Method of Forming an Electronic Device
Acid Generators and Photoresists Comprising Same
Photoresists Comprising Carbamate Component
Photoacid Generator, Photoresist, Coated Substrate, and Method of Forming an Electronic Device
Photoacid-Generating Copolymer and Associated Photoresist Composition, Coated Substrate, and Method of Forming an Electronic Device
Substituted Aryl Onium Materials
Aryl Acetate Onium Materials
Aryl Acetate Onium Materials
Photoacid-Generating Copolymer and Associated Photoresist Composition, Coated Substrate, and Method of Forming an Electronic Device
Copolymer with Acid-Labile Group, Photoresist Composition, Coated Substrate, and Method of Forming an Electronic Device
Photoresist Composition and Associated Method of Forming an Electronic Device
Photoresist Composition and Associated Method of Forming an Electronic Device
Polymer Comprising Repeat Units with Photoacid-Generating Functionality and Base-Solubility-Enhancing Functionality, and Associated Photoresist Composition and Electronic Device Forming Method
Polymer Comprising Repeat Units with Photoacid-Generating Functionality and Base-Solubility-Enhancing Functionality, and Associated Photoresist Composition and Electronic Device Forming Method
Nanoparticle - Polymer Resists
Acid Generator Compounds and Photoresists Comprising Same
Photoacid Generator
Photoacid Generator
Photoresist Composition, Coated Substrate Including the Photoresist Composition, and Method of Forming Electronic Device
Photoresist Composition, Coated Substrate Including the Photoresist Composition, and Method of Forming Electronic Device
Photoacid-Generating Monomer, Polymer Derived Therefrom, Photoresist Composition Including the Polymer, and Method of Forming a Photoresist Relief Image Using the Photoresist Composition
Photoacid-Generating Monomer, Polymer Derived Therefrom, Photoresist Composition Including the Polymer, and Method of Forming a Photoresist Relief Image Using the Photoresist Composition
Radiation-Sensitive Compositions and Patterning and Metallization Processes
Radiation-Sensitive Compositions and Patterning and Metallization Processes
Photoacid-Generating Compound, Polymer Derived Therefrom, Photoresist Composition Including the Photoacid-Generating Compound or Polymer, and Method of Forming a Photoresist Relief Image
Photoacid-Generating Compound and Associated Polymer, Photoresist Composition, and Method of Forming a Photoresist Relief Image
Acid-Cleavable Monomer and Polymers Including the Same
Iodine-Containing Polymers for Chemically Amplified Resist Compositions
Iodine-Containing Polymers for Chemically Amplified Resist Compositions
Salts and Photoresists Comprising Same
Salts and Photoresists Comprising Same
Zwitterion Compounds and Photoresists Comprising Same
Photoresist Compositions and Pattern Formation Methods
Photoresist Compositions and Methods
Iodine-Containing Photoacid Generators and Compositions Comprising the Same
Monomers, Polymers and Lithographic Compositions Comprising Same
Polymers and Photoresist Compositions
Application:
16/653,690 →
Publication:
US US20210108065A1
Photoresist Compositions and Pattern Formation Methods
Polymers and Photoresist Compositions
Application:
16/731,666 →
Publication:
US US20210200084A1
Polymer, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
18/090,638 →
Publication:
US US20240241441A1
Photoresist Compositions and Pattern Formation Methods
Iodine-Containing Acid Cleavable Compounds, Polymers Derived Therefrom, and Photoresist Compositions
Application:
17/490,923 →
Publication:
US US20230103685A1
Photoresist Compositions and Pattern Formation Methods
Application:
17/506,082 →
Publication:
US US20220137509A1
Photoresist Compositions and Pattern Formation Methods
Application:
17/462,216 →
Publication:
US US20220091506A1
Photoresist Compositions and Pattern Formation Methods
Compounds and Photoresist Compositions Including the Same
Photoresist Compositions and Pattern Formation Methods
Photoresist Compositions and Pattern Formation Methods
Application:
17/490,974 →
Publication:
US US20230104679A1
Photoacid Generators, Photoresist Compositions, and Pattern Formation Methods
Photoresist Compositions and Pattern Formation Methods
Polymers Useful as Surface Leveling Agents
Application:
18/521,544 →
Publication:
US US20240093027A1
Polymers Useful as Surface Leveling Agents
Photoresist Compositions and Pattern Formation Methods
Application:
17/940,682 →
Publication:
US US20230152697A1
Photoresist Compositions and Pattern Formation Methods
Photoactive Compounds, Photoresist Compositions Including the Same, and Pattern Formation Methods
Photoactive Compounds, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
18/352,646 →
Publication:
US US20240027904A1
Photoresist Compositions and Pattern Formation Methods
Application:
18/085,098 →
Publication:
US US20230213862A1
Metallization Method
Photoresist Compositions and Pattern Formation Methods
Application:
63/533,270 →
Photoacid Generators, Photoresist Compositions, and Pattern Formation Methods
Application:
18/354,410 →
Publication:
US US20240027905A1
Metallization Method
Photoresist Composition and Metallization Method
Application:
18/222,666 →
Publication:
US US20250102910A1
Polymer, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
17/985,439 →
Publication:
US US20240184201A1
Polymer, Photoresist Compositions Including the Same, and Pattern Formation Methods
Multiblock Copolymers, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
18/481,018 →
Publication:
US US20250116933A1
Compounds, Monomers, Polymers, Photoresist Compositions and Pattern Formation Methods
Application:
18/324,450 →
Publication:
US US20240393689A1
Coating Compositions and Methods
Application:
63/623,089 →
Methods, Photoresists and Substrates for Ion-Implant Lithography
Cyanoadamantyl Compounds and Polymers and Photoresists Comprising Same
Cyanoadamantyl Compounds and Polymers
Photoresist Compositions
Photoresist Compositions
Photoresist Compositions Comprising Resin Blends
Compositions and processes for immersion lithography
Compositions and Processes for Immersion Lithography
Compositions and Processes for Immersion Lithography
Compositions and Processes for Immersion Lithography
Phenolic Polymers and Photoresists Comprising Same
Phenolic polymers and photoresists comprising same
Compositions and Processes for Immersion Lithography
Photoresists comprising novolak resin blends
Compositions and Processes for Immersion Lithography
Compositions and Processes for Immersion Lithography
Compositons and Processes for Immersion Lithography
Photosensitive Compositions
Photoresists and Methods of Use Thereof
Photoresists and Methods for Use Thereof
Photoresists and Methods for Use Thereof
Photoresists and Methods for Use Thereof
Compositions and processes for photolithography
Compositions Comprising Sulfonamide Material and Processes for Photolithography
Compositions comprising sulfonamide material and processes for photolithography
Photoacid Generators and Photoresists Comprising Same
Compositions Comprising Base-Reactive Component and Processes for Photolithography
Cholate Photoacid Generators and Photoresists Comprising Same
Cholate Photoacid Generators and Photoresists Comprising Same
Sulfonyl Photoacid Generators and Photoresists Comprising Same
Sulfonyl Photoacid Generators and Photoresists Comprising Same
Photoresist Comprising Nitrogen-Containing Compound
Patent:
9,475,763 →
Application:
14/589,759 →
Photoresist Comprising Nitrogen-Containing Compound
Block copolymer and methods relating thereto
Metal Hardmask Compositions
Metal Hardmask Compositions
Hardmask
Hardmask Surface Treatment
Hardmask Surface Treatment
Hardmask
Hardmask
Resins for Underlayers
Aromatic Resins for Underlayers
Aromatic Resins for Underlayers
Aromatic Resins for Underlayers
Aromatic Resins for Underlayers
Polyarylene Materials
Polyarylene Polymers
Aromatic Resins for Underlayers
Coating Composition for Photoresist Underlayer
Method Using Silicon-Containing Underlayers
Aromatic Resins for Underlayers
Polyarylene Resins
Silicon-Containing Underlayers
Silicon-Containing Underlayers
Gap-Filling Method
Aromatic Underlayer
Aromatic Underlayer
Aromatic Underlayer
Resist Underlayer Compositions and Methods of Forming Patterns with Such Compositions
Application:
16/530,273 →
Publication:
US US20200348592A1
Coating Compositions and Methods of Forming Electronic Devices
Resist Underlayer Compositions and Pattern Formation Methods Using Such Compositions
Photoresist Underlayer Compositions and Methods of Forming Electronic Devices
Application:
18/537,020 →
Publication:
US US20240264528A1
Underlayer Compositions and Patterning Methods
Application:
17/007,903 →
Publication:
US US20220066321A1
Coating Compositions and Methods of Forming Electronic Devices
Photoresist Underlayer Compositions and Patterning Methods
Application:
17/124,743 →
Publication:
US US20220197141A1
Adhesion Promoting Photoresist Underlayer Composition
Delivery device and method of use thereof
Delivery Device
Transparent Conductive Articles
Polymer Composite for Encapsulating Quantum Dots
High Refractive Index Curable Liquid Light Emitting Diode Encapsulant Formulation
Patent:
8,258,636 →
Application:
13/109,045 →
Curable liquid composite light emitting diode encapsulant
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2010
From: CALZIA, KEVIN; MOSLEY, DAVID W.; SZMANDA, CHARLES R.; THORSEN, DAVID L.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 023783/0286 →
Assignment of Assignor's Interest
Jan 14, 2010
From: CALZIA, KEVIN; MOSLEY, DAVID W.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 023783/0254 →
Assignment of Assignor's Interest
Feb 3, 2010
From: CASPERS, PETER JACOBUS; THIO, HOK BING; PUPPELS, GERWIN JAN; KEMPERMAN, PATRICK M.J.H.
To: RIVER DIAGNOSTICS B.V.
Reel/Frame 023891/0867 →
Assignment of Assignor's Interest
Jul 15, 2013
From: CALZIA, KEVIN; MOSLEY, DAVID W.; SZMANDA, CHARLES R.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 030797/0233 →
Assignment of Assignor's Interest
Apr 29, 2014
From: NIAZIMBETOVA, ZUKHRA I.; RZEZNIK, MARIA ANNA
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 032782/0502 →
Assignment of Assignor's Interest
Apr 11, 2021
From: WANG, DEYAN; SONG, YIXUAN
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 055884/0990 →
Assignment of Assignor's Interest
May 3, 2021
From: KINZIE, CHARLES R.; LITCHFIELD, BRIAN; MULZER, CATHERINE; GILMORE, CHRISTOPHER D.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 056120/0259 →
Assignment of Assignor's Interest
May 3, 2021
From: WANG, DEYAN; SONG, YIXUAN
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 056120/0366 →
Assignment of Assignor's Interest
Jun 1, 2021
From: WANG, DEYAN; LIU, SHENG
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 056401/0727 →
Assignment of Assignor's Interest
Dec 7, 2021
From: PATTERSON, ANASTASIA; SECKMAN, BETHANY L; WANG, DEYAN; GILMORE, CHRISTOPHER D
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 058324/0546 →
Assignment of Assignor's Interest
Jan 28, 2022
From: RACHFORD, AARON A.; GALLAGHER, MICHAEL K.; GILMORE, CHRISTOPHER; KIM, YOUNG-SEOK
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 058804/0278 →
Assignment of Assignor's Interest
Jan 28, 2022
From: GALLAGHER, MICHAEL K.; JOO, JAKE; KONDOH, MASAKI; SHEN, YI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 058812/0698 →
Assignment of Assignor's Interest
Feb 6, 2024
From: LEE, HEELIM; LEE, SU MIN; YOON, HEE JAE
To: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Reel/Frame 066388/0917 →
Assignment of Assignor's Interest
Feb 21, 2024
From: HOSTETLER, GREG ALAN
To: DUPONT ELECTRONICS, INC.
Reel/Frame 066513/0615 →
Assignment of Assignor's Interest
Feb 21, 2024
From: PATTERSON, ANASTASIA LILY; SECKMAN, BETHANY; SNYDER, RACHEL; WANG, DEYAN
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 066513/0414 →
Change of Name
Oct 17, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD
To: DUPONT SPECIALTY MATERIALS KOREA LTD
Reel/Frame 069185/0438 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →