Metal plating compositions
View Patent ↗Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
1. A composition comprising one or more sources of metal ions, one or more suppressors and one or more compounds having a formula:
R 1 -A-R 3 -A-[C(O)—R 5 —C(O)-A-R 3 -A] n -R 2 (I)
where A is —NH—; or —NH—R 6 —;
R 1 is random, alternating or block —(CHR 9 CHR 10 O) p —H, where
R 9 and R 10 are the same or different and are —H, —CH 3 , or —CH 2 CH 3 and
p is an integer from 1 to 50;
R 2 is random, alternating or block —(CHR 9 CHR 10 O) p —H; or —C(O)—R 5 —C(O)OH;
R 3 is —(CH 2 ) r —NH—R 4 —(CH 2 ) r —; —(CH 2 ) r —NH—(CH 2 ) r —; —(CH 2 ) r —(OC 2 H 4 )—O—(CH 2 ) r ; or —(CH 2 ) r — and
r is an integer from 1 to 8;
R 4 is random, alternating or block —(CHR 9 CHR 10 O) p —;
R 5 is —(CH 2 ) q — where q is an integer from 1 to 8;
R 6 is random, alternating or block —(CHR 9 CHR 10 O) p —; and n is an integer of 1 to 10.
2. The composition of claim 1 , wherein the metal ions are chosen from copper, tin, nickel, gold, silver, palladium, platinum, indium or mixtures thereof.
3. The composition of claim 2 , wherein the metal ions are copper.
4. The composition of claim 1 , further comprising one or more additives chosen from brighteners, surfactants, acids, brightener breakdown inhibition compounds and alkali metal salts.