Photoresists comprising carbamate component
New photoresist compositions are provided that comprise a carbamate compound that comprises 1) a carbamate group and 2) an ester group. Preferred photoresists of the invention may comprise a resin with acid-labile groups; an acid generator compound; and a carbamate compound that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer.
1. A photoresist composition comprising:
(a) a resin;
(b) an acid generator; and
(c) a non-polymeric carbamate compound that comprises i) a carbamate group and ii) an ester group,
wherein the carbamate compound corresponds to a structure of the following Formula I:
wherein:
R1 and R2 are each the same or different non-hydrogen substituent;
L1 is a linker group that comprises at least one carbon atom;
L2 is a non-hydrogen substituent;
and wherein:
L2 and R2 may be optionally taken together to form a ring structure;
L1 and L2 may be optionally taken together to form a ring structure;
R1 and L1 or R1 and L2 may be optionally taken together to form a ring structure; and
both of R1 and R2 comprises an acid-labile moiety.
2. The photoresist composition of claim 1 wherein at least one of R1 and R2 comprises a tertiary alkyl group, and/or at least one of R1 and R2 comprises an acetal or ketal group.
3. The photoresist composition of claim 1 wherein L2 and R2 are taken together to form a ring structure; L1 and L2 are taken together to form a ring structure; or R1 and L1 or R1 and L2 are taken together to form a ring structure.
4. The photoresist composition of claim 1 wherein the photoresist comprises one or more of the following:
5. The photoresist composition of claim 1 wherein the carbamate compound comprises both 1) a carbamate group that comprises an acid-labile moiety and 2) an ester group that comprises an acid-labile moiety.
6. The photoresist composition of claim 1 wherein the carbamate compound corresponds to a structure of the following Formula IA:
wherein in Formula IA, R1 and R2 are each the same or different non-hydrogen substituent;
the depicted two semi-circular lines between N and L3 together represent an optionally substituted single-ring or multiple-ring structure having 5 to 20 atoms with N and one or more atoms of L3 being ring members; and
L3 contains 1 to 16 carbon or hetero atoms.
7. The photoresist composition of claim 6 wherein L3 contains only carbon atoms.
8. The photoresist composition of claim 1 wherein L2 and R2 are taken together to form a ring structure.
9. The photoresist composition of claim 1 wherein L1 and L2 are taken together to form a ring structure.
10. The photoresist composition of claim 1 wherein R1 is part of an ester acid-labile group with the OC(═O)— moiety of Formula I.
11. The photoresist composition of claim 1 wherein L2 an R2 are taken together to form a ring structure; L1 and L2 are taken together to form a ring structure; or R1 and L1 or R1 and L2 are taken together to form a ring structure.
12. A method for forming a photoresist relief image comprising:
(a) applying a coating layer of a photoresist composition of claim 1 on a substrate;
(b) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.
13. The method of claim 12 wherein the activating radiation is EUV or electron-beam radiation.
14. A photoresist composition comprising:
(a) a resin;
(b) an acid generator; and
(c) a carbamate compound that comprises a structure of the following Formulae IB or IC:
wherein in each of Formulae IB and IC, R1 and R2 are each the same or different non-hydrogen substituent; and
L3 contains 1 to 16 carbon or hetero atoms.
15. The photoresist composition of claim 14 wherein L3 contains only carbon atoms.
16. The photoresist composition of claim 15 wherein the carbamate compound corresponds to a structure of Formula IB.
17. The photoresist composition of claim 15 wherein the carbamate compound corresponds to a structure of Formula IC.
18. The photoresist composition of claim 14 wherein the carbamate compound corresponds to a structure of Formula IB.
19. The photoresist composition of claim 14 wherein the carbamate compound corresponds to a structure of Formula IC.
20. A method for forming a photoresist relief image comprising:
(a) applying a coating layer of a photoresist composition of claim 4 on a substrate;
(b) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.
21. A photoresist composition comprising:
(a) a resin;
(b) an acid generator; and
(c) a non-polymeric carbamate compound that comprises i) a carbamate group and ii) an ester group,
wherein the carbamate compound corresponds to a structure of the following Formula I:
wherein:
R1 and R2 are each the same or different non-hydrogen substituent;
L1 is a linker group that comprises at least one carbon atom;
L2 is a non-hydrogen substituent;
and wherein at least one of R1 and R2 comprises an acid-labile moiety, and at least one of R1 and R2 comprises an acetal or ketal group.
22. The photoresist composition of claim 21 wherein both of R1 and R2 comprise an acid-labile moiety.
23. The photoresist composition of claim 21 wherein at least one of R1 and R2 comprises a tertiary alkyl group.
24. A photoresist composition comprising:
(a) a resin;
(b) an acid generator; and
(c) a non-polymeric carbamate compound that comprises i) a carbamate group and ii) an ester group;
wherein the carbamate compound corresponds to a structure of the following Formula I:
wherein:
R1 and R2 are each the same or different non-hydrogen substituent;
L1 is a linker group that comprises at least one carbon atom;
L2 is a non-hydrogen substituent;
and wherein:
L2 and R2 are taken together to form a ring structure;
L1 and L2 may be optionally taken together to form a ring structure;
R1 and L1 or R1 and L2 may be optionally taken together to form a ring structure; and
at least one of R1 and R2 comprises an acid-labile moiety.