Copper plating process
View Patent ↗Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.
1. A copper plating method comprising:
a) activating an object to be plated with a pre-dip solution comprising acid and from 0.75 mg/l to 1000 mg/l of bromide ions, the object is of copper;
b) contacting the object to be plated with a pre-treatment solution containing at least 0.75 mg/l of bromide ions; and
c) precipitating a copper plate of 20 microns to 8 microns on the object by electrolytic copper plating using a copper plating solution containing copper ions, electrolytes, chloride ions and bromide ions, the chloride ions and the bromide ions are at concentrations to fulfill relationships of equations:
(1) (Cl−30)/20<Br (130+Cl)/20, (2) 50−Cl<10×Br and (3) 10<Cl
wherein Cl is chloride ion concentration in the copper plating solution in mg/l and Br is bromide ion concentration in the copper plating solution in mg/l.
2. The copper plating method of claim 1 , wherein the pre-treatment solution further comprises one or more surfactants.
3. The copper plating method of claim 1 , wherein the acid of the pre-dip solution is sulfuric acid.
4. The copper plating method of claim 1 , further comprising a step of degreasing the object to be plated with a degreasing solution prior to activating the object to be plated with the pre-dip solution, the degreasing solution comprises at least 50 mg/l of bromide ions.
5. A copper plating method comprising:
a) contacting an object to be plated with a pre-treatment solution containing from 0.75 mg/l to 1000 mg/l of bromide ions, the object is of copper; and
b) precipitating a copper plate on the object by electrolytic copper plating using a copper plating solution containing copper ions, electrolytes, chloride ions
and bromide ions, the chloride ions and the bromide ions are at concentrations to fulfill relationships of equations:
(4) 3≦Br≦(70−Cl)/15 and (5) 20≦Cl wherein Cl is chloride ion concentration
in the copper plating solution in mg/l and Br is bromide ion concentration in the copper plating solution in mg/l.
6. A copper plating method comprising:
a) contacting an object to be plated with a pre-treatment solution containing from 0.75 ml/l to 1000 mg/l of bromide ions, the object is of copper; and
b) precipitating a copper plate on the object by electrolytic copper plating using a copper plating solution containing copper ions, electrolytes, chloride ions and bromide ions, the chloride ions and the bromide ions are at concentrations to fulfill relationships of equations:
(6) 3≦Br≦6 and (7) 30≦Cl wherein Cl is chloride ion concentration
in the copper plating solution in mg/l and Br is bromide ion concentration in the copper plating solution in mg/l.
7. The copper plating method of claim 6 , wherein the copper plate is 15 microns to 8 microns.
8. The copper plating method of claim 7 , wherein the copper plate is 12 microns to 8 microns.