IP Library Granted Patent US 9,790,606
Granted Patent B2
US 9,790,606 · App. 14/556,154 · Granted Oct 17, 2017

Method of treating gold or gold alloy with a surface treatment solution comprising a disulfide compound

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Quick Facts
Patent No.
US 9,790,606
App. No.
14/556,154
Granted
Oct 17, 2017
Kind
B2
Abstract

To provide a surface treatment solution and treatment method for gold or gold alloy plating that effectively suppresses corrosion of underlying metal or substrate metal from pinholes that develop on the gold or gold alloy plating film. [Solution] A surface treatment solution containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by the following formula (2) is preferred as the disulfide compound. X 1 O 3 S—R 3 —S—S—R 4 —SO 3 X 2   (2) in the formula, R 3 and R 4 independently represent a linear or branched alkylene group having from 1 to 10 carbon atoms, cyclic alkylene group having from 3 to 10 carbon atoms, or phenylene group, R 3 and R 4 independently may be substituted by one or more substituents selected from an alkyl group, halogen atom, hydroxyl group, or alkoxy group, and X 1 and X 2 represent monovalent cations.

Claims (5)

1. A surface treatment method for gold or gold alloy plating film formed on nickel or nickel alloy underlayer, wherein the surface treatment method comprises a step for bringing the gold or gold alloy plating film formed on the nickel or nickel alloy underlayer into contact with a surface treatment solution consisting of water, at least one type of disulfide compound, wherein the disulfide compound is represented by the following formula (2):

X 1 O 3 S—R 3 —S—S—R 4 —SO 3 X 2   (2)

wherein R 3 and R 4 independently represent a linear or branched alkylene group having from 1 to 6 carbon atoms, or phenylene group, R 3 and R 4 independently may be substituted by one or more substituents selected from halogen atom, hydroxyl group, or alkoxy group, and X l and X 2 represent monovalent cations,

a nonionic surfactant and a pH adjuster chosen from hydrochloric acid, nitric acid, sulfuric acid, citric acid, potassium hydroxide, sodium hydroxide or carbonates, wherein a pH of the surface treatment solution is 3 or higher.

2. The surface treatment method of claim 1 , wherein the nonionic surfactant is chosen from polyethylene glycol, polyoxyalkylene monobutyl ether, polyoxypropylene glycol or ethylene glycol-propylene glycol block polymers.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2015
From: ROHM AND HAAS ELECTRONIC MATERIALS KK
To: ROHM AND HAAS ELECRONIC MATERIALS LLC
Reel/Frame 035369/0661 →