Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
1. An electroplating bath comprising one or more sources of copper ions, one or more accelerators, one or more suppressors, one or more electrolytes and one or more compounds comprising a reaction product of an amine and an acrylamide, wherein the amine has a formula:
wherein r, s and t are independently numbers from 1 to 10; and the acrylamide has a formula:
wherein R″ comprises a moiety having a structure:
or
a moiety having a structure:
wherein R 15 comprises hydrogen or hydroxyl; u is an integer from 1 to 2 and v, x, and y are independently integers of 1 to 10.
2. The electroplating bath of claim 1 , wherein the compound is in amounts of 0.01 ppm to 1000 ppm.
3. The electroplating bath of claim 1 , further comprising one or more sources of tin ions.
4. A method of electroplating comprising:
a) providing a substrate;
b) immersing the substrate in the electroplating bath of claim 1 ;
c) applying a current to the substrate and the electroplating bath; and
d) electroplating copper on the substrate.
5. The method of claim 4 , wherein the substrate comprises one or more of through-holes and blind vias.