IP Library Granted Patent US 7,776,506
Granted Patent B2
US 7,776,506 · App. 11/651,090 · Granted Aug 17, 2010

Coating compositions for photoresists

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Quick Facts
Patent No.
US 7,776,506
App. No.
11/651,090
Granted
Aug 17, 2010
Kind
B2
Abstract

In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.

Claims (12)

1. A coated substrate comprising:

(a) a coating layer of a photoresist composition;

(b) above the photoresist composition, an applied composition comprising: (i) a resin component, and wherein at least 50 weight percent of all polymeric materials present in the coating composition comprise one or more resins that are at least substantially free of fluorine; (ii) an acid or acid generator compound; and (iii) a fluorinated component.

2. The substrate of claim 1 wherein the resin component comprises an acrylate polymer that is at least substantially free of fluorine.

3. The substrate of claim 1 wherein the applied composition comprises an acid generator compound.

4. The substrate of claim 1 wherein the applied composition comprises a polymer that has one or more non-acrylate repeat units.

5. A method for processing an electronic device substrate, comprising:

(a) applying a photoresist layer on substrate;

(b) applying above the photoresist layer a composition comprising: (i) a resin component, and wherein at least 50 weight percent of all polymeric materials present in the coating composition comprise one or more resins that are at least substantially free of fluorine; (ii) an acid or acid generator compound; and (iii) a fluorinated component.

6. The method of claim 5 wherein the resin comprises (1) an acrylate polymer that is at least substantially free of fluorine; and (2) one or more of (a) a fluorinated resin, (b) acid or acid generator compound and (c) surfactant.

7. The method of claim 5 wherein the applied composition comprises acid generator compound.

8. The method of claim 5 further comprising immersion exposing the photoresist layer.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2007
From: WANG, DEYAN; TREFONAS III, PETER; GALLAGHER, MICHAEL K.
To: ROHM AND HAAS ELECTRONIC MATERIALS, LLC
Reel/Frame 019049/0102 →