IP Library Granted Patent US 12,104,061
Granted Patent B2
US 12,104,061 · App. 18/219,833 · Granted Oct 1, 2024

UV curable silicone composition and an encapsulant or a sheet film thereof

Inventors: Shunya Takeuchi (Chiba, JP); Anna Ya Ching Feng (Taoyuan, TW); Yutaka Oka (Chiba, JP); Jung Hye Chae (Gyeonggi-do, KR)
Assignees: DuPont Toray Specialty Materials Kabushiki Kaisha; DuPont Electronic Materials International, LLC; DuPont Specialty Materials Korea Ltd.
C08L83/04C08G77/20C08G77/28C08G77/80C08K5/132C08K5/18C08K5/5397C08L2201/08C08L2201/10C08L2203/16C08L2203/206C08L2205/025C08L2205/03C08L2312/06
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,104,061
App. No.
18/219,833
Granted
Oct 1, 2024
Kind
B2
Abstract

A UV curable silicone composition has exceptional curability by ultraviolet irradiation. The UV curable silicone composition includes (A) an organopolysiloxane composition selected from the following: (A-1) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule, (A-2) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, or (A-3) an organopolysiloxane composition comprising an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, but furthermore comprising an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound, and (B) a silicone-compatible photo-initiator comprising a compound selected from the following: (B-1) an alpha-hydroxyacetophenone, (B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or (B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, wherein the ratio between the thiol groups and alkenyl groups (SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more.

Claims (43)

1. A UV curable silicone composition consisting of:

(A-1) an organopolysiloxane composition consisting of a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule,

(B) a silicone-miscible photo-initiator comprising a compound selected from the following:

(B-1) an alpha-hydroxyacetophenone,

(B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or

(B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide,

and

(C) one or more component selected from the group consisting of sensitizers, free radical scavengers, and polymerization inhibitors,

wherein the mole ratio between the thiol groups (—SH) and alkenyl groups (—SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more, and

wherein the photo-initiator (B) includes 0% by mass to 10 by mass of photo-initiator other than an alphahydroxyacetophenone alpha-aminoalkylphenone, or monoacylphosphine oxide, based on the total mass of component (B).

2. The UV curable silicone composition as claimed in claim 1 , wherein the organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain in component (A-1) is a cyclic structure.

3. The UV curable silicone composition as claimed in claim 1 , wherein the photo-initiator of (B-1) further comprises a compound having an acetophenone structure other than alpha-hydroxyacetophenone.

4. The UV curable silicone composition as claimed in claim 1 , wherein the content of component (B) is 0.001% by mass to 5% by mass based on the total mass of the UV curable silicone composition.

5. An encapsulant or sheet film comprising the cured product of the UV curable silicone composition as claimed in claim 1 .

6. The UV curable silicone composition as claimed in claim 2 , wherein the photo-initiator of (B-1) further comprises a compound having an acetophenone structure other than alpha-hydroxyacetophenone.

7. The UV curable silicone composition as claimed in claim 2 , wherein the content of component (B) is 0.001% by mass to 5% by mass based on the total mass of the UV curable silicone composition.

8. A UV curable silicone composition consisting of:

(A-2) an organopolysiloxane composition consisting of a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain,

(B) a silicone-miscible photo-initiator comprising a compound selected from the following:

(B-1) an alpha-hydroxyacetophenone,

(B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or

(B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, and

(C) one or more component selected from the group consisting of sensitizers, free radical scavengers, and polymerization inhibitors,

wherein the mole ratio between the thiol groups (—SH) and alkenyl groups (—SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more, and

wherein the photo-initiator (B) includes 0% by mass to 10 by mass of photo-initiator other than an alphahydroxyacetophenone alpha-aminoalkylphenone, or monoacylphosphine oxide, based on the total mass of component (B).

9. The UV curable silicone composition as claimed in claim 8 , wherein the organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain in component (A-2) is a linear structure.

10. The UV curable silicone composition as claimed in claim 8 , wherein the photo-initiator of (B-1) further comprises a compound having an acetophenone structure other than alpha-hydroxyacetophenone.

11. The UV curable silicone composition as claimed in claim 8 , wherein the content of component (B) is 0.001% by mass to 5% by mass based on the total mass of the UV curable silicone composition.

12. An encapsulant or sheet film comprising the cured product of the UV curable silicone composition as claimed in claim 8 .

13. A UV curable silicone composition consisting of:

(A-3) an organopolysiloxane composition consisting of an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, provided that component (A-3) comprises an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound,

(B) a silicone-miscible photo-initiator comprising a compound selected from the following:

(B-1) an alpha-hydroxyacetophenone,

(B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or

(B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide,

and

(C) one or more component selected from the group consisting of sensitizers, free radical scavengers, and polymerization inhibitors,

wherein the mole ratio between the thiol groups (—SH) and alkenyl groups (—SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more, and

wherein the photo-initiator (B) includes 0% by mass to 10 by mass of photo-initiator other than an alphahydroxyacetophenone alpha-aminoalkylphenone, or monoacylphosphine oxide, based on the total mass of component (B).

14. The UV curable silicone composition as claimed in claim 13 , wherein the multifunctional thiol compound of component (A-3) is a compound containing 2 to 6 functional primary and secondary thiol groups.

15. The UV curable silicone composition as claimed in claim 13 , wherein the photo-initiator of (B-1) further comprises a compound having an acetophenone structure other than alpha-hydroxyacetophenone.

16. The UV curable silicone composition as claimed in claim 13 , wherein the content of component (B) is 0.001% by mass to 5% by mass based on the total mass of the UV curable silicone composition.

17. An encapsulant or sheet film comprising the cured product of the UV curable silicone composition as claimed in claim 13 .

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2025
From: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
To: DUROPTIX MATERIALS KABUSHIKI KAISHA
Reel/Frame 073229/0238 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
CHANGE OF NAME Recorded Oct 17, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD
To: DUPONT SPECIALTY MATERIALS KOREA LTD
Reel/Frame 069185/0438 →
CHANGE OF NAME Recorded Jul 11, 2024
From: ROHM AND HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 068281/0164 →
CHANGE OF NAME Recorded Jul 11, 2024
From: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
To: DUPONT SPECIALTY MATERIALS KOREA LTD.
Reel/Frame 068281/0096 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: TAKEUCHI, SHUNYA; OKA, YUTAKA
To: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Reel/Frame 064211/0507 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: FENG, ANNA YA CHING
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 064211/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2023
From: CHAE, JUNG HYE
To: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Reel/Frame 064211/0482 →
Cited By (1)
US 12,637,544