Patent Assignment
Reel/Frame 073229/0238
Assignment of Assignor's Interest
Recorded: 2025-12-16
Pages: 5
Assignor
DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Executed: 2025-12-04
Assignee
DUROPTIX MATERIALS KABUSHIKI KAISHA
11-1, NAGATA-CHO 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(27)
Optical Semiconductor Device and Method of Manufacturing Thereof
Curable Organopolysiloxane Resin Composition and Optical Part Molded Therefrom
Insulating Liquid Die-Bonding Agent and Semiconductor Device
Curable Silicone Composition
Adhesion-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device
Curable Organopolysiloxane Composition and Semiconductor Device
Curable Organopolysiloxane Composition and Optical Semiconductor Device
Curable Silicone Composition For Sealing An Optical Semiconductor Element, Method Of Producing A Resin-Sealed Optical Semiconductor Element, And Resin-Sealed Optical Semiconductor Element
Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
Curable Silicone Composition And Optical Semiconductor Device
Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
Curable Organopolysiloxane Composition and Semiconductor Device
Curable Silicone Composition for Die Bonding Use
A Method of Manufacturing an Optoelectronic Device
Optical Member Resin Sheet, Optical Member, Layered Body, or Light-Emitting Device Comprising Optical Member Resin Sheet, and Method for Manufacturing Optical Member Resin Sheet
Curable Silicone Composition, Optical Semiconductor Device and a Method of Manufacturing the Same
Curable Hotmelt Silicone Composition, Encapsulant, Film and Optical Semiconductor Device
Curable White Silicone Formulation, a Reflective Material for Optical Semiconductor Module and Optical Semiconductor Device
Curable White Silicone Formulation, a Reflective Material for Optical Semiconductor Module, and Optical Semiconductor Device
Uv Curable Silicone Composition and an Encapsulant or a Sheet Film Thereof
Curable Silicone Composition, Encapsulant and Optical Semiconductor Device
Application:
17/347,861 →
Publication:
US 2022/0049121
Curable Silicone Composition, Encapsulant and Optical Semiconductor Device
Curable Silicone Composition, Encapsulant and Optical Semiconductor Device
Thermosetting Silicone Composition
Uv Curable Silicone Composition and an Encapsulant or a Sheet Film Thereof
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2014
From: MIYAMOTO, YUSUKE; YOSHITAKE, MAKOTO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 033656/0077 →
Assignment of Assignor's Interest
Jan 6, 2015
From: MIYAMOTO, YUSUKE; YOSHITAKE, MAKOTO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 034643/0181 →
Assignment of Assignor's Interest
Mar 26, 2015
From: MIYAMOTO, YUSUKE; YOSHITAKE, MAKOTO; YOSHIDA, HIROAKI; NAKATA, TOSHIKI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 035266/0334 →
Assignment of Assignor's Interest
May 18, 2015
From: KOBAYASHI, AKIHIKO; OKA, YUTAKA; SUTO, MICHITAKA; IIMURA, TOMOHIRO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 035657/0088 →
Assignment of Assignor's Interest
Aug 25, 2015
From: SAGAWA, TAKASHI; AMAKO, MASAAKI; ITOH, MAKI; SUTO, MICHITAKA
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 036408/0079 →
Assignment of Assignor's Interest
Mar 9, 2016
From: NISHIJIMA, KAZUHIRO; IIMURA, TOMOHIRO; SUTO, MICHITAKA; SAGAWA, TAKASHI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 037929/0128 →
Assignment of Assignor's Interest
Aug 23, 2019
From: YAMAZAKI, RYOSUKE; NISHIJIMA, KAZUHIRO; IIMURA, TOMOHIRO; SUTOH, MANABU
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 050144/0131 →
Assignment of Assignor's Interest
Dec 4, 2019
From: YAMAZAKI, RYOSUKE; YAMAMOTO, SHINICHI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 051178/0641 →
Assignment of Assignor's Interest
Dec 6, 2019
From: NISHIDA, FUMITO
To: DOW CORNING CORPORATION
Reel/Frame 051206/0422 →
Assignment of Assignor's Interest
Dec 6, 2019
From: FENG, ANNA YA CHING
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 051206/0462 →
Assignment of Assignor's Interest
Dec 6, 2019
From: AMAKO, MASAAKI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 051218/0594 →
Assignment of Assignor's Interest
Dec 9, 2019
From: AMAKO, MASAAKI; TSUDA, TAKEAKI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 051217/0839 →
Change of Name
Sep 3, 2020
From: DOW CORNING TORAY CO., LTD.
To: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Reel/Frame 053681/0507 →
Assignment of Assignor's Interest
Feb 6, 2023
From: DOW SILICONES CORPORATION (F/K/A DOW CORNING CORPORATION)
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 063300/0030 →
Change of Name
Mar 24, 2023
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 063164/0733 →
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
Change of Name
May 12, 2025
From: DOW CORNING TORAY COMPANY, LTD.
To: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Reel/Frame 071080/0537 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →