Curable organopolysiloxane composition and semiconductor device
The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d . In the formula, R 1 's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R 1 's per molecule represent hydrogen atoms, R 2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0≤c≤0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6≤a/d 1.5, 1.5≤b/d≤3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.
1. A curable organopolysiloxane composition comprising at least
(A) an organopolysiloxane having at least 2 alkenyl groups per molecule;
(B) an organopolysiloxane resin represented by the average unit formula:
(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d
where each R 1 is the same or different hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond, but at least two R 1 per molecule are hydrogen atoms, R 2 is a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, 0≤c<0.2, and 0<d<1, but 0.6≤a/d≤1.5, 1.5≤b/d≤3, and a+b+c+d=1
and present at a quantity so that the molar ratio of silicon-bonded hydrogen in the component (B) to alkenyl groups in the component (A) is 0.5 to 5;
and
(C) a hydrosilylation catalyst present at a sufficient quantity to cure the composition.
2. The curable organopolysiloxane composition according to claim 1 , also comprising (D) 1 to 20 parts by mass of fumed silica having a BET specific surface area of 20 to 200 m 2 /g to 100 total parts by mass of the components (A) to (C).
3. The curable organopolysiloxane composition according to claim 1 , also comprising (E) 0.001 to 5 parts by mass of a hydrosilylation inhibitor to 100 total parts by mass of the components (A) to (C).
4. The curable organopolysiloxane composition according to claim 1 , also comprising (F) 0.01 to 10 parts by mass of an adhesion promoter to 100 total parts by mass of the components (A) to (C).
5. The curable organopolysiloxane composition according to claim 1 , also comprising (G) an organopolysiloxane represented by the average formula:
R 3 R 4 2 SiO(R 4 2 SiO) m (R 4 HSiO) n SiR 4 2 R 3
where each R 3 is the same or different hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond, R 4 is the same or different monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond, m is a number of 0 to 50, and n is a number of 0 to 50, but if n is 0, R 3 is hydrogen
and present at a quantity so that the molar ratio of silicon-bonded hydrogen in the component (G) to alkenyl groups in the component (A) is at most 0.5.
6. The curable organopolysiloxane composition according to claim 1 , wherein curing forms a cured material having a durometer D hardness prescribed by JIS K 6253 of 30 to 70.
7. The curable organopolysiloxane composition according to claim 1 , comprising an adhesive of a semiconductor element.
8. A semiconductor device, characterized in that a semiconductor element is adhered by a cured material of the curable organopolysiloxane composition according to claim 1 .