Method of manufacturing an optoelectronic device
Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane.
1. A method of manufacturing an optoelectronic device comprising:
i) providing a substrate wherein the substrate comprises one or more electro-optic component arranged on at least one surface of the substrate;
ii) contacting the surface of the electro-optic component parallel to the substrate with a lateral filler film comprising a filler and a curable silicone hot melt;
iii) contacting the lateral filler film with a release liner; and
iv) applying pressure to the lateral filler film, and
v) removing a residue that is formed on the top surface of the electro-optic component, to create the optoelectronic device.
2. The method of claim 1 wherein the electro-optic component is a light emitting diode.
3. The method of claim 1 wherein the curable silicone hot melt is a crosslinkable resin-linear polyorganosiloxane formulation.
4. The method of claim 1 wherein the lateral filler film is uncured prior to applying pressure.
5. The method of claim 1 wherein the filler comprises a compound selected from the group consisting of TiO 2 , BN, SiO 2 , Al 2 O 3 , ZnO, BaSO 4 , and mixtures thereof.
6. The method of claim 1 wherein the residue is removed by wiping with a solvent.
7. The method of claim 1 wherein the solvent comprises isopropyl alcohol, acetone, heptane, octane, propylpropionate, toluene, and mixtures thereof.
8. An optoelectronic device manufactured by the method of claim 1 .
9. The method of claim 1 wherein the electro-optic component is an LED chip, and wherein after pressure is applied, a residue is formed on the top surface of the LED chip and is further removed.
10. The method of claim 1 wherein the thickness of the lateral filler film is arranged to the same or less as the height of the electro-optic component from the surface of the substrate prior to contacting it to the surface of the electro-optic component.
11. A method of manufacturing an optoelectronic device comprising:
i) providing a substrate wherein the substrate comprises one or more electro-optic component arranged on at least one surface of the substrate,
ii) contacting the surface of the electro-optic component parallel to the substrate with a lateral filler film comprising a filler and a curable silicone hot melt;
iii) contacting the lateral filler film with a release liner;
iv) applying pressure to create the optoelectronic device;
v) applying a wavelength conversion layer on top of the created optoelectronic device; and
vi) curing simultaneously.
12. An optoelectronic device manufactured by the method of claim 11 .