Curable silicone composition
View Patent ↗A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO 4/2 units, R 1 2 R 2 SiO 1/2 units, and R 1 3 SiO 1/2 units, wherein R 1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R 2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
1. A curable silicone composition comprising at least the following components:
(A) a diorganopolysiloxane having in one molecule at least two alkenyl groups;
(B) at least two resinous organopolysiloxanes having a difference of at least 1,000 between their mass-average molecular weights as reduced into standard polystyrene measured by gel permeation chromatography wherein one of the at least two resinous organopolysiloxanes has a higher mass-average molecular weight relative to the other of the at least two resinous organopolysiloxanes, and the mass ratio of the higher mass-average molecular weight resinous organopolysiloxane to the lower mass-average molecular weight resinous organopolysiloxane is in the range of 50:50 to 10:90, wherein the at least two resinous organopolysiloxanes are composed of SiO 4/2 units, R 1 2 R 2 SiO 1/2 units, and R 1 3 SiO 1/2 units, wherein R 1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R 2 is an alkenyl group, and wherein component (B) has a mass-average molecular weight in the range of 100 to 10,000 and is used in the amount of 40 to 100 parts by mass per 100 parts by mass of component (A);
(C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms, wherein the silicon-bonded hydrogen atoms contained in this component are used in the amount of 0.1 to 10 moles per one mole of all alkenyl groups contained in components (A) and (B); and
(D) a hydrosilylation catalyst in a catalytic quantity.
2. The curable silicone composition of claim 1 , wherein component (B) is composed of at least two resinous organopolysiloxanes having a difference of at least 1,500 between their mass-average molecular weights.
3. The curable silicone composition of claim 1 , wherein component (B) is composed of at least two resinous organopolysiloxanes having a difference of at least 2,000 between their mass-average molecular weights.
4. The curable silicone composition of claim 1 , wherein R 1 is a methyl or phenyl group.
5. The curable silicone composition of claim 1 , wherein component (B) is free of hexenyl and cyclohexenyl groups.
6. The curable silicone composition of claim 1 , wherein component (A) is selected from the group of a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups, a copolymer of methylvinylsiloxane and dimethylsiloxane capped at both molecular terminals with dimethylvinylsiloxy, a copolymer of methylphenylsiloxane and dimethylsiloxane capped at both molecular terminals with dimethylvinylsiloxy, methylvinylpolysiloxane capped at both molecular terminals with trimethylsiloxy, a copolymer of methylvinylsiloxane and a dimethylsiloxane capped at both molecular terminals with trimethylsiloxy, and combinations thereof.
7. The curable silicone composition of claim 1 , wherein R 2 is a vinyl group.