Curable silicone composition, cured product thereof, and optical semiconductor device
View Patent ↗The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula and having at least two alkenyl groups in a molecule, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, wherein at least 80 mass % of this component comprises an organotrisiloxane represented by the formula: H(CH 3 ) 2 SiO(C 6 H 5 ) 2 SiOSi(CH 3 ) 2 H, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and high reactivity and forms a cured product with low gas permeability.
1. A curable silicone composition comprising:
(A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the following average unit formula:
(R 1 R 2 R 3 SiO 1/2 ) a (R 4 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c
wherein, R 1 is an alkyl group having from 1 to 12 carbons; each R 2 is the same or different aryl groups having from 6 to 20 carbons or aralkyl groups having from 7 to 20 carbons; R 3 is an alkenyl group having from 2 to 12 carbons; each R 4 is the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, or phenyl groups; and “a”, “b”, and “c” are respectively numbers satisfying 0.01≦a≦0.5, 0≦b≦0.7, 0.1≦c<0.9, and a+b+c=1;
(B) a straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, in 0 to 70 mass % of this composition;
(C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and at least 80 mass % of this component comprising an organotrisiloxane represented by the following formula:
H(CH 3 ) 2 SiO(C 6 H 5 ) 2 SiOSi(CH 3 ) 2 H,
in an amount that the amount of silicon-bonded hydrogen atoms in this component is from 0.1 to 5 mol per 1 mol of total alkenyl groups in components (A) and (B);
and
(D) an effective amount of a hydrosilylation reaction catalyst.
2. The curable silicone composition according to claim 1 , wherein each R 2 in component (A) is a phenyl group or a naphthyl group.
3. A cured product produced by curing the curable silicone composition of claim 1 .
4. An optical semiconductor device, wherein an optical semiconductor element is sealed by a cured product of the curable silicone composition of claim 1 .
5. The curable silicone composition according to claim 1 , wherein R 1 is a methyl group.
6. The curable silicone composition according to claim 2 , wherein R 1 is a methyl group.
7. The curable silicone composition according to claim 6 , wherein R 3 is a vinyl group.
8. The curable silicone composition according to claim 1 , wherein R 3 is a vinyl group.
9. The curable silicone composition according to claim 1 , wherein “a”, “b”, and “c” are respectively numbers satisfying 0.05≦a≦0.4, 0≦b≦0.4, 0.45≦c<0.8, and a+b+c=1.
10. The curable silicone composition according to claim 1 , wherein each of the at least two alkenyl groups of said straight-chain organopolysiloxane is a vinyl group.
11. The curable silicone composition according to claim 1 , wherein component (C) is present such that the amount of silicon-bonded hydrogen atoms in this component is from 0.5 to 2 mol per 1 mol of total alkenyl groups in components (A) and (B).
12. The curable silicone composition according to claim 1 further defined as an adhesive, a potting agent, a protective agent, a coating agent, or an underfill agent for electrical/electronic use.
13. A cured product produced by curing the curable silicone composition of claim 2 .
14. An optical semiconductor device, wherein an optical semiconductor element is sealed by a cured product of the curable silicone composition of claim 2 .