Curable silicone composition, encapsulant and optical semiconductor device
View Patent ↗A curable silicone composition is capable of forming a cured product having excellent elongation characteristics. The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where in formula (I), each R 1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c<0.9, 0≤d<0.5, 0≤e<0.4, a+b+c+d=1.0, and c+d>0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.
1. A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (1): (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where in formula (1), each R 1 is independently a monovalent hydrocarbon group, while the number of alkenyl groups per molecule is one or more and is less than two on average, X is a hydrogen atom or an alkyl group, a is 0.05≤a≤0.8, b is 0≤b≤0.9, c is 0.1≤c≤0.9, d=0, e is 0≤e≤0.15, a+b+c=d=1.0 and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B).
2. The curable silicone composition as claimed in claim 1 , wherein the mass ratio of the resinous organopolysiloxane and linear organopolysiloxane is 9:1 to 1:9.
3. An encapsulant comprising the curable silicone composition described in claim 1 .
4. An optical semiconductor device comprising the encapsulant described in claim 3 .
5. The curable silicone composition as claimed in claim 1 , wherein the resinous alkenyl group-containing organopolysiloxane (A) contains an alkenyl group in its molecular terminal.
6. The curable silicone composition as claimed in claim 1 , wherein the resinous alkenyl group-containing organopolysiloxane (A) has from 1 to 1.9 alkenyl groups per molecule on average.
7. The curable silicone composition as claimed in claim 1 , wherein the organohydrogenpolysiloxane of component (B) is a branched structure.
8. The curable silicone composition as claimed in claim 1 , wherein the organohydrogenpolysiloxane of component (B) includes at least one siloxane unit (unit T) represented by SiO 3/2 and/or siloxane unit (unit Q) represented by SiO 4/2 .
9. The curable silicone composition as claimed in claim 1 , wherein the organopolysiloxane of component (D) includes a linear organopolysiloxane represented by general formula (II):
R 1 3 SiO(R 1 2 SiO) m SR 1 3
where in formula (II), each R 1 is independently a monovalent hydrocarbon group, and m is an integer of from 5 to 1000.
10. A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (XO 1/2 ) e, where in formula (I), each R 1 is independently a monovalent hydrocarbon group, while the number of alkenyl groups per molecule is one or more and is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c<0.9, d=0, 0≤e<0.4, a+b+c+d=1.0, and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B), wherein the organopolysiloxane of component (D) includes a cyclic organopolysiloxane represented by general formula (III):
(R 1 2 SiO) n ,
where in formula (III), each R 1 is independently a monovalent hydrocarbon group, and n is an integer of from 3 to 50.
11. An optical semiconductor device comprising an encapsulant which comprises the curable silicone composition described in claim 10 .
12. A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I): (R 1 3 SiO 2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (XO 1/2 ) e, where in formula (I), each R 1 is independently a monovalent hydrocarbon group, while the number of alkenyl groups per molecule is one or more and is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c<0.9, d=0, 0≤e<0.4, a+b+c+d=1.0, and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B), wherein the organopolysiloxane of component (D) includes an epoxy group-containing resinous organopolysiloxane represented by average unit formula (IV):
(R 2 3 SiO 1/2 ) a (R 2 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (XO 1/2 )
where in formula (IV), each R 2 is the same or different optionally halogen-substituted monovalent hydrocarbon group or epoxy group-containing organic group, at least one R 2 is an epoxy group-containing organic group, X is a hydrogen atom or an alkyl group, and 0≤a≤1, 0≤b≤1, 0≤c<0.9, 0≤d<0.5, 0≤e<0.4, a+b+c+d=1.0, and c+d>0.
13. An optical semiconductor device comprising an encapsulant which comprises the curable silicone composition described in claim 12 .
14. The curable silicone composition as claimed in claim 12 , wherein the organopolysiloxane of component (D) further includes a linear organopolysiloxane represented by general formula (II):
R 1 3 SiO(R 1 2 SiO) m SR 1 3
where in formula (II), each R 1 is independently a monovalent hydrocarbon group, and m is an integer of from 5 to 1000.
15. A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (1): (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where in formula (1), each R 1 is independently a monovalent hydrocarbon group, where the number of alkenyl groups per molecule is from 1 to 1.9 alkenyl groups per molecule on average, X is a hydrogen atom or an alkyl group, a is 0≤a≤1, b is 0≤b≤1, c is 0≤c≤0.9, d=0, e is 0≤e≤0.4, a+b+c=d=1.0 and c+d>0;
(B) an organohydrogenpolysiloxane having three or more silicon atom-bonded hydrogen atoms per molecule;
(C) a curing reaction catalyst; and
(D) an organopolysiloxane which is different from components (A) and (B).