Curable silicone composition and optical semiconductor device

1. A hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element; the hydrosilylation reaction curable silicone composition comprising at least one compound selected from the group consisting of triazole-based compounds with the exception of non-substituted benzotriazole, wherein the triazole-based compound is selected from the group consisting of N-alkyl substituted triazoles, N-alkylaminoalkyl substituted triazoles, alkyl substituted benzotriazoles, carboxy substituted benzotriazoles, and nitro substituted benzotriazoles.

2. The hydrosilylation reaction curable silicone composition according to claim 1 ; wherein the hydrosilylation reaction curable silicone composition comprises:

(A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule;

(B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule;

(C) at least one type of compound selected from the group consisting of triazole-based compounds with the exception of non-substituted benzotriazole; and

(D) a hydrosilylation reaction catalyst.

3. The hydrosilylation reaction curable silicone composition according to claim 2 ; wherein component (A) is an organopolysiloxane represented by the following average composition formula:

(R 1 SiO 3/2 ) a (R 2 R 3 SiO 2/2 ) b (R 4 R 5 R 6 SiO 1/2 ) c (SiO 4/2 ) d

wherein, R 1 to R 6 may be identical or different monovalent hydrocarbon groups, from 0.01 to 50 mol % of all monovalent hydrocarbon groups are aliphatic unsaturated hydrocarbon groups; a, b, c, and d represent mole ratios of the respective siloxane units and are numbers that respectively satisfy: a+b+c+d=1.0, 0≦a≦1.0, 0≦b≦1.0, 0≦c<0.83, and 0≦d<0.50.

4. The hydrosilylation reaction curable silicone composition according to claim 3 ; wherein component (B) is an organohydrogenpolysiloxane represented by the following average composition formula:

R 7 e H f SiO [(4-e-f)/2]

wherein, R 7 is a substituted or non-substituted monovalent hydrocarbon group with the exception of aliphatic unsaturated hydrocarbon groups; and e and f are numbers that respectively satisfy: 1.0≦e≦2.0, 0.1<f<1.0, and 1.5≦e+f<2.7.

5. The hydrosilylation reaction curable silicone composition according to claim 2 ; wherein component (B) is an organohydrogenpolysiloxane represented by the following average composition formula:

R 7 e H f SiO [(4-e-f)/2]

wherein, R 7 is a substituted or non-substituted monovalent hydrocarbon group with the exception of aliphatic unsaturated hydrocarbon groups; and e and f are numbers that respectively satisfy: 1.0≦e≦2.0, 0.1<f<1.0, and 1.5≦e+f<2.7.

6. An optical semiconductor device fabricated by using the hydrosilylation reaction curable silicone composition described in claim 1 for sealing, coating, or adhering an optical semiconductor element.

7. The optical semiconductor device according to claim 6 , wherein the optical semiconductor element is a light emitting diode.

8. The hydrosilylation reaction curable silicone composition according to claim 1 ; wherein the triazole-based compound is selected from the group consisting of N,N-bis(2-ethylhexyl)-[(1,2,4-triazol-1-yl)methyl]amine, tolyl triazole, carboxybenzotriazole, and nitrobenzotriazole.

9. The hydrosilylation reaction curable silicone composition according to any claim 1 ; wherein a content of the triazole-based compound in the hydrosilylation reaction curable silicone composition is 0.01 ppm to 3% by mass.