Curable silicone composition, encapsulant and optical semiconductor device
A curable silicone composition comprises (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO4/2) unit, (B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO4/2) unit, (C) a catalyst for hydrosilylation reaction, and (D) a curing reaction inhibitor. The curable silicone composition exhibits practically effective curability even at low temperatures, has a low shape deformation and shrinkage rate during curing, can be cured in a short period of time, and can form a transparent and high-hardness cured product.
1. A curable silicone composition which forms a cured product of having a type D durometer hardness of 30 or more at 25° C. and having a light transmittance of 95% or more at wavelengths ranging from 400 nm to 700 nm, said curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO 4/2 ) unit, wherein said resinous alkenyl group-containing organopolysiloxane (A) is present in an amount of 4 mass % or more based on a total mass of organopolysiloxane components in said curable silicone composition and which is represented by the following average unit formula (II):
(R 1 3 SiO 1/2 ) a (SiO 4/2 ) d (XO 1/2 ) e (II),
wherein each R 1 are the same or different C 1-6 alkyl groups or C 2-6 alkenyl groups and where at least two R 1 in one molecule are alkenyl groups, wherein X is a hydrogen atom or an alkyl group, and wherein 0.2≤a<1, 0<d<0.8, 0≤e<0.4, and a+d=1.0 are satisfied,
(B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO 4/2 ) unit, wherein said resinous organohydrogenpolysiloxane (B) is present in an amount of 2 mass % or more based on the total mass of organopolysiloxane components in said curable silicone composition and which is represented by the following average unit formula (IV):
(R 2 3 SiO 1/2 ) a (SiO 4/2 ) d (XO 1/2 ) e (IV),
wherein each R 2 are the same or different and comprise a hydrogen atom or a C 1-6 alkyl group and where at least two R 2 in one molecule are hydrogen atoms, wherein X is a hydrogen atom or an alkyl group, and wherein 0.2≤a<1, 0≤d≤0.8, 0≤e<0.4, and a+d=1.0 are satisfied,
wherein the viscosity of component (B) is within the range of from 1 mPa to 500 mPa at 25° C.,
(C) a catalyst for hydrosilylation reaction,
(D) a curing reaction inhibitor,
(E) (E-1) a linear alkenyl group-containing organopolysiloxane having at least one aryl group in one molecule, wherein an aryl group content in said linear alkenyl group-containing organopolysiloxane (E-1) is 10 mol % or more of a total content of silicon atom-bonded organic groups in said curable silicone composition and (E-2) a resinous alkenyl group-containing organopolysiloxane free from siloxane units represented by (SiO 4/2 ) and having at least one aryl group in one molecule, wherein said resinous alkenyl group-containing organopolysiloxane (E-2) is present in at an amount of 30 mass % or more based on the total mass of organopolysiloxane components in said curable silicone composition, wherein an aryl group content in said resinous alkenyl group-containing organopolysiloxane (E-2) is 3 mol % or more of a total content of silicon atom-bonded organic groups in said curable silicone composition, and
(F) a linear organohydrogenpolysiloxane having at least one aryl group in one molecule, wherein an aryl group content in said linear organohydrogenpolysiloxane (F) is 10 mol % or more of a total content of silicon atom-bonded organic groups in said linear organohydrogenpolysiloxane in said curable silicone composition.
2. The curable silicone composition as claimed in claim 1 , wherein (C) the catalyst for hydrosilylation reaction is a platinum-based catalyst and is included in an amount such that the content of the platinum atoms is 10 ppm or less with respect to the total mass of the curable silicone composition.
3. The curable silicone composition as claimed in claim 1 , wherein the content of (D) the curing reaction inhibitor is 200 ppm or more with respect to the total mass of the curable silicone composition.
4. The curable silicone composition as claimed in claim 1 , further comprising both of a linear alkenyl group-containing organopolysiloxane having at least one aryl group in one molecule and a resinous alkenyl group-containing organopolysiloxane free from siloxane units represented by (SiO 4/2 ) and having at least one aryl group in one molecule.
5. The curable silicone composition as claimed in claim 1 , further comprising silica as an inorganic filler.
6. An encapsulant comprising the curable silicone composition as claimed in claim 1 .
7. An optical semiconductor device comprising the encapsulant as claimed in claim 6 .
8. The curable silicone composition as claimed in claim 2 , wherein the content of (D) the curing reaction inhibitor is 200 ppm or more with respect to the total mass of the curable silicone composition.
9. The curable silicone composition as claimed in claim 1 , wherein the cured product of the curable silicone composition has a type D durometer hardness of 30 or more at 25° C.
10. A curable silicone composition which provides a transparent cured product having a type D durometer hardness of 20 or more at 25° C. when cured at a temperature of 60° C., the curable silicone composition comprising:
(A) a resinous alkenyl group containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO 4/2 ) unit, wherein said resinous alkenyl group-containing organopolysiloxane (A) is present in an amount of 10 mass % or more based on a total mass of organopolysiloxane components in said curable silicone composition, which is represented by the following average unit formula (II):
(R 1 3 SiO 1/2 ) a (SiO 4/2 ) d (XO 1/2 ) e (II),
wherein R 1 are the same or different optionally halogen-substituted monovalent hydrocarbons where at least two R 1 in one molecule are alkenyl groups, wherein X is a hydrogen atom or an alkyl group, and wherein 0≤a<1, 0<d<0.8, 0≤e<0.4, and a+d=1.0 are satisfied,
(B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO 4/2 ) unit, wherein said resinous organohydrogenpolysiloxane (B) is present in an amount of 6.5 mass % or more based on a total mass of organopolysiloxane components in said curable silicone composition, which is represented by the following average unit formula (IV):
(R 2 3 SiO 1/2 ) a (SiO 4/2 ) d (XO 1/2 ) e (IV),
wherein each R 2 are the same or different and comprise a hydrogen atom or an optionally halogen-substituted monovalent hydrocarbon group other than an alkenyl group where at least two R 2 in one molecule are hydrogen atoms, wherein X is a hydrogen atom or an alkyl group, and wherein 0≤a<1.0, 0≤d≤0.8, 0≤e<0.4, and a+d=1.0 are satisfied,
wherein the viscosity of component (B) is within the range of from 1 mPa to 500 mPa at 25° C.,
(C) a catalyst for hydrosilylation reaction,
(D) a curing reaction inhibitor;
(E) (E-1) a linear alkenyl group-containing organopolysiloxane having at least one aryl group in one molecule, wherein an aryl group content in said linear alkenyl group-containing organopolysiloxane (E-1) is 10 mol % or more of a total content of silicon atom-bonded organic groups in said curable silicone composition and (E-2) a resinous alkenyl group-containing organopolysiloxane free from siloxane units represented by (SiO 4/2 ) and having at least one aryl group in one molecule, wherein said resinous alkenyl group-containing organopolysiloxane (E-2) is present in an amount of 30 mass % or more based on the total mass of organopolysiloxane components in said curable silicone composition, and wherein an aryl group content in said resinous alkenyl group-containing organopolysiloxane (E-2) is 3 mol % or more of a total content of silicon atom-bonded organic groups in said curable silicone composition, and
(F) a linear organohydrogenpolysiloxane having at least one aryl group in one molecule, wherein an aryl group content in said linear organohydrogenpolysiloxane is 10 mol % or more of a total content of silicon atom-bonded organic groups in said linear organohydrogenpolysiloxane in said curable silicone composition, and wherein a ratio between silicon-bonded hydrogen atoms and alkenyl groups in said curable silicone composition is greater than 1.0.
11. The curable silicone composition as claimed in claim 1 , wherein the cured product of the curable silicone composition has a type D durometer hardness of 20 or more at 25° C.