Insulating liquid die-bonding agent and semiconductor device
View Patent ↗An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
1. An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising:
(A) 100 parts by mass of a mixture of (a-1) an organopolysiloxane resin composed of siloxane units of formula R 1 3 SiO 1/2 , siloxane units of formula R 1 2 R 2 SiO 1/2 , and siloxane units of formula SiO 4/2 (wherein R 1 is a univalent hydrocarbon group, except for an alkenyl group, and R 2 is an alkenyl group) and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups, with a mass ratio of (a-1) to (a-2) in the range of (30:70) to (60:40);
(B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms, where component (B) is used in such an amount that the mole ratio of the silicon-bonded hydrogen atoms of this component to 1 mole of alkenyl groups of component (A) is within the range of 0.1 to 10 moles;
(C) 0.1 to 10 parts by mass of an organic silicon compound having in one molecule at least one silicon-bonded alkoxy group;
(D) 5 to 50 parts by mass of insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and
(E) a catalytic quantity of a hydrosilylation-reaction catalyst;
wherein component (D) is aggregated with an average diameter of aggregated particles of 1 to 100 μm.
2. The insulating liquid die-bonding agent of claim 1 , having a viscosity of 100 to 500 Pa·s at 25° C.
3. A semiconductor device wherein a semiconductor-chip-mounting member is bonded to an active surface of a semiconductor chip with the use of the insulating liquid die-bonding agent of claim 2 .
4. The insulating liquid die-bonding agent of claim 2 , having a viscosity of 150 to 300 Pa·s at 25° C.
5. A semiconductor device wherein a semiconductor-chip-mounting member is bonded to an active surface of a semiconductor chip with the use of the insulating liquid die-bonding agent of claim 1 .
6. The insulating liquid die-bonding agent of claim 1 , wherein component (D) has a type A durometer hardness according to JIS K 6253 equal to or below 50.
7. The insulating liquid die-bonding agent of claim 1 , wherein component (D) has an average diameter of 0.1 to 30 μm.
8. The insulating liquid die-bonding agent of claim 1 , wherein component (D) is present from 15 to 40 parts by mass.
9. The insulating liquid die-bonding agent of claim 1 , wherein component (B) is used in such an amount that the mole ratio of the silicon-bonded hydrogen atoms of component (B) to 1 mole of alkenyl groups of component (A) is within the range of from 0.1 to 5 moles.
10. The insulating liquid die-bonding agent of claim 1 , wherein (a-1) is represented by an organopolysiloxane copolymer comprising siloxane units selected from the following formulae: (CH 3 ) 3 SiO 1/2 ; (CH 3 ) 2 (CH 2 =CH) SiO 1/2 ; and SiO 4/2 ; and an organopolysiloxane copolymer comprising siloxane units selected from the following formulae: (C 6 H 5 )(CH 3 ) 2 SiO 1/2 ; (CH 3 ) 2 (CH 2 =CH) SiO 1/2 ; and SiO 4/2 .
11. The insulating liquid die-bonding agent of claim 10 , wherein (a-2) is selected from the group of: a copolymer of methylvinylsiloxane and dimethylsiloxane capped at both molecular terminals with trimethylsiloxy groups; a methylvinylpolysiloxane capped at both molecular terminals with trimethylsiloxy groups; a copolymer of methylphenylsiloxane, methylvinylsiloxane, and dimethylsiloxane capped at both molecular terminals with trimethylsiloxy groups; a dimethylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups; methylvinylpolysiloxane capped at both molecular terminals with dimethylvinylsiloxy groups; a copolymer of methylvinylsiloxane and dimethylsiloxane capped at both molecular terminals with dimethylvinylsiloxy groups; and a copolymer of methylphenylsiloxane, methylvinylsiloxane, and dimethylsiloxane capped at both molecular terminals with dimethylvinylsiloxy groups.
12. The insulating liquid die-bonding agent of claim 1 , wherein the average diameter of aggregated particles is 1 to 50 μm.