IP Library › Assignment 022335/0809
Patent Assignment
Reel/Frame 022335/0809

Assignment of Assignor's Interest

Recorded: 2009-03-03 Pages: 3
Assignors
FUJISAWA, TOYOHIKO
Executed: 2008-01-28
USHIO, YOSHITO
Executed: 2008-01-28
Assignee
DOW CORNING TORAY COMPANY, LTD.
1-3, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0005, JAPAN
Covered Property (1)
Insulating Liquid Die-Bonding Agent and Semiconductor Device
Patent: 7,897,717 →
Application: 12/065,135 →
Publication: US 2009/0263936
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 12, 2025
From: DOW CORNING TORAY COMPANY, LTD.
To: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Reel/Frame 071080/0537 →
Assignment of Assignor's Interest Dec 16, 2025
From: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
To: DUROPTIX MATERIALS KABUSHIKI KAISHA
Reel/Frame 073229/0238 →