IP Library Granted Patent US 10,718,059
Granted Patent B2
US 10,718,059 · App. 15/973,824 · Granted Jul 21, 2020

Nickel electroplating compositions with cationic polymers and methods of electroplating nickel

Inventors: Michael Lipschutz (Natick, MA); Sen Kang (Shoreview, MN)
Assignee: Rohm and Haas Electronic Materials LLC
C25D3/18
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Quick Facts
Patent No.
US 10,718,059
App. No.
15/973,824
Granted
Jul 21, 2020
Kind
B2
Abstract

Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.

Claims (15)

1. A nickel electroplating composition comprising one or more sources of nickel ions, one or more compounds chosen from sodium saccharinate, boric acid and salts of boric acid, optionally, one or more sources of acetate ions, and one or more cationic polymers, wherein the one or more cationic polymers are a reaction product of one or more imidazole compounds having a formula:

wherein R 1 , R 2 and R 3 are independently chosen from H, (C 1 -C 12 )alkyl, aryl, aryl(C 1 -C 6 )alkyl, and amino(C 1 -C 6 )alkyl, and wherein R 1 and R 2 can be taken together with all of their carbon atoms to form a fused six membered ring and one or more bisepoxides having a formula:

wherein Y 1 and Y 2 are independently chosen from H and linear or branched (C 1 -C 4 )alkyl;

A is OR 4 or R 5 , wherein R 4 is ((CR 6 R 7 ) m )O) n , wherein R 6 and R 7 are independently chosen from H, hydroxyl and methyl, and R 5 is (CH 2 ) y , wherein m is a number from 1 to 6, n is a number from 1 to 20 and y is a number from 0 to 6 and when y is 0, A is a covalent chemical bond; and one or more optional additives.

2. The nickel electroplating composition of claim 1 , wherein the one or more cationic polymers are in amounts of at least 0.5 ppm.

3. The nickel electroplating composition of claim 1 , further comprising one or more sources of chloride.

4. The nickel electroplating composition of claim 1 , wherein a pH of the nickel electroplating composition is from 2 to 6.

5. A method of electroplating nickel metal on a substrate comprising:

a) providing the substrate;

b) contacting the substrate with a nickel electroplating composition comprising one or more sources of nickel ions, one or more compounds chosen from sodium saccharinate, boric acid and salts of boric acid, optionally, one or more sources of acetate ions, and one or more cationic polymers, wherein the one or more cationic polymers are a reaction product of one or more imidazole compounds having a formula:

wherein R 1 , R 2 and R 3 are independently chosen from H, (C 1 -C 12 )alkyl, aryl, aryl(C 1 -C 6 )alkyl, and amino(C 1 -C 6 )alkyl, and wherein R 1 and R 2 can be taken together with all of their carbon atoms to form a fused six membered ring and one or more bisepoxides having a formula:

wherein Y 1 and Y 2 are independently chosen from H and linear or branched (C 1 -C 4 )alkyl; A is OR 4 or R 5 , wherein R 4 is ((CR 6 R 7 ) m )O) n , R 6 and R 7 are independently chosen from H, hydroxyl and methyl, and R 5 is (CH 2 ) y , wherein m is a number from 1 to 6, n is a number from 1 to 20 and y is a number from 0 to 6 and when y is 0, A is a chemical bond; and one or more optional additives; and

c) applying an electric current to the nickel electroplating composition and substrate to electroplate a bright and uniform nickel deposit adjacent the substrate.

6. The method of claim 5 , wherein the nickel electroplating composition further comprises one or more sources of chloride.

7. The method of claim 5 , wherein the nickel electroplating composition has a pH of 2 to 6.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2020
From: LIPSCHUTZ, MICHAEL; KANG, SEN
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 052947/0247 →
Continuity (2)
Provisional Application 62530451 · Jul 10, 2017
Related Publication 20190010625A1 · Jan 10, 2019