IP Library Granted Patent US 9,562,169
Granted Patent B2
US 9,562,169 · App. 14/750,180 · Granted Feb 7, 2017

Metal hardmask compositions

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Quick Facts
Patent No.
US 9,562,169
App. No.
14/750,180
Granted
Feb 7, 2017
Kind
B2
Abstract

The invention provides a composition comprising at least the following A and B: A) a polymer comprising, in polymerized from, at least one “monomer that comprises at least one hydroxyl group;” and B) an organometal compound comprising at least one metal selected from Ti, Zr, Hf, Co, Mn, Zn, or combinations thereof, and wherein the organometal compound is present in an amount greater than 5 weight percent, based on the sum weight of A and B.

Claims (32)

1. A composition comprising at least the following A and B:

A) a polymer comprising, in polymerized from, at least one monomer that comprises at least one hydroxyl group; and

B) an organometal compound comprising at least one metal selected from Ti, Zr, Hf, Co, Mn, Zn, or combinations thereof, and wherein the organometal compound is present in an amount greater than 20 weight percent, based on the sum weight of A and B; and

wherein the polymer of component A further comprises an acrylate, an alkyl acrylate, a methacrylate, or an ethacrylate.

2. The composition of claim 1 , wherein the alkyl acrylate is tert-butyl-acrylate.

3. The composition of claim 1 , wherein the polymer of component A comprises less than 1 weight percent silicon, based on the weight of the polymer.

4. The composition of composition of claim 1 , wherein component A is present in an amount greater than 20 weight percent, based on the sum weight of A and B.

5. The composition of composition of claim 1 , wherein component A is present in an amount greater than 50 weight percent, based on the sum weight of A and B.

6. The composition of claim 1 , wherein component B is present in an amount less than 80 weight percent, based on the sum weight of A and B.

7. The composition of claim 1 , wherein the organometal compound is chelated with at least two oxygen atoms.

8. The composition of claim 1 , wherein the metal of the organometal compound comprises a metal selected from Ti, Zr, or combinations thereof.

9. The composition of claim 1 , wherein the organometal compound is selected from the following compounds:

or combinations thereof, and

wherein R1, R2, R3, R4, R5, R6, R7 and R8 are each independently selected from the following:

i) hydrocarbon group,

ii) a substituted hydrocarbon group,

iii) a hydrocarbon group containing at least one heteroatom in its backbone, or

iv) a substituted hydrocarbon group containing at least one heteroatom in its backbone; and

wherein R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19 and R20 are each independently selected from the following:

i) a hydrogen atom,

ii) a hydrocarbon group,

iii) a substituted hydrocarbon group,

iv) a hydrocarbon group containing at least one heteroatom in its backbone, or

v) a substituted hydrocarbon group containing at least one heteroatom in its backbone.

10. A chelated metal compound formed from the composition of claim 1 , and comprising at least one ligand derived from the polymer of component A.

11. An article comprising at least one component formed from the composition of claim 1 .

12. The article of claim 11 , wherein the article is an electronic device.

13. A hardmask formed from the composition of claim 1 .

14. A method of forming a coated substrate, said method comprising at least the following:

a) applying the composition of claim 1 over at least a portion of the substrate,

b) thermally treating the composition to form the coating.

15. The method of claim 14 , wherein the coating is a hardmask layer.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2016
From: WANG, DEYAN; SUN, JIBIN; TREFONAS, PETER; O'CONNELL, KATHLEEN M
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 040327/0593 →