IP Library Granted Patent US 9,581,904
Granted Patent B2
US 9,581,904 · App. 14/927,357 · Granted Feb 28, 2017

Photoresist overcoat compositions

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Quick Facts
Patent No.
US 9,581,904
App. No.
14/927,357
Granted
Feb 28, 2017
Kind
B2
Abstract

Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes.

Claims (43)

1. A photoresist overcoat composition, comprising:

a matrix polymer comprising a unit formed from a monomer of the following general formula (I):

wherein: R 1 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 2 is chosen from optionally substituted C1 to C15 alkyl; X 1 is oxygen, sulfur or is represented by the formula NR 3 , wherein R 3 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and Z 1 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —COO— and —CONR 4 — wherein R 4 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and

an additive polymer comprising a unit formed from a monomer of the following general formula (II):

wherein: R 10 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 11 is chosen from optionally substituted C1 to C15 alkyl; X 2 is oxygen, sulfur or is represented by the formula NR 12 , wherein R 12 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and Z 3 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —NHSO 2 —, —COO— and —CONR 13 — wherein R 13 is chosen from hydrogen and optionally substituted C1 to C10 alkyl;

a basic quencher; and

an organic solvent;

wherein the additive polymer has a lower surface energy than a surface energy of the matrix polymer, and wherein the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition; and

wherein the composition is free of photoacid generator compounds.

2. The photoresist overcoat composition of claim 1 , wherein the additive polymer comprises a unit containing a fluorine atom.

3. The photoresist overcoat composition of claim 2 , wherein the additive polymer comprises a unit containing a fluoroalcohol.

4. The photoresist overcoat composition of claim 1 , wherein the matrix polymer is free of fluorine and silicon.

5. The photoresist overcoat composition of claim 1 , wherein the basic quencher comprises a basic moiety on the matrix polymer.

6. The photoresist overcoat composition of claim 1 , wherein the basic quencher is an additive separate from the additive polymer and the matrix polymer.

7. The photoresist overcoat composition of claim 1 , wherein the additive polymer is present in the overcoat composition in an amount of from 3 to 15 wt % based on total solids of the overcoat composition.

8. The photoresist overcoat composition of claim 1 , wherein the matrix polymer is present in the overcoat composition in an amount of from 70 to 99 wt % based on total solids of the overcoat composition.

9. A photoresist overcoat composition, comprising:

a matrix polymer comprising a unit formed from a monomer of the following general formula (I):

wherein: R 1 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 2 is chosen from optionally substituted C1 to C15 alkyl; X 1 is oxygen, sulfur or is represented by the formula NR 3 wherein R 3 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and Z 1 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —COO— and —CONR 4 — wherein R 4 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and

an additive polymer comprising a unit formed from a monomer of the following general formula (III):

wherein: R 14 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 15 is independently chosen from optionally substituted C1 to C15 alkyl; X 3 is oxygen, sulfur or is represented by the formula NR 16 , wherein R 16 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; Z 4 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —COO— and —CONR 17 —, wherein R 17 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and n is an integer from 0 to 2;

a basic quencher; and

an organic solvent;

wherein the additive polymer has a lower surface energy than a surface energy of the matrix polymer, and wherein the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition.

10. The photoresist overcoat composition of claim 9 , wherein the additive polymer comprises a unit containing a fluorine atom.

11. The photoresist overcoat composition of claim 9 , wherein the additive polymer comprises a unit containing a fluoroalcohol.

12. The photoresist overcoat composition of claim 9 , wherein the matrix polymer is free of fluorine and silicon.

13. The photoresist overcoat composition of claim 9 , wherein the basic quencher comprises a basic moiety on the matrix polymer.

14. The photoresist overcoat composition of claim 9 , wherein the basic quencher is an additive separate from the additive polymer and the matrix polymer.

15. The photoresist overcoat composition of claim 9 , wherein the additive polymer is present in the overcoat composition in an amount of from 3 to 15 wt % based on total solids of the overcoat composition.

16. The photoresist overcoat composition of claim 9 , wherein the matrix polymer is present in the overcoat composition in an amount of from 70 to 99 wt % based on total solids of the overcoat composition.

17. The photoresist overcoat composition of claim 9 , wherein the composition is free of photoacid generator compounds.

18. A photoresist overcoat composition, comprising:

a matrix polymer comprising a unit formed from a monomer of the following general formula (I):

wherein: R 1 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 2 is chosen from optionally substituted C1 to C15 alkyl; X 1 is oxygen, sulfur or is represented by the formula NR 3 , wherein R 3 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and Z 1 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —COO— and —CONR 4 — wherein R 4 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and

an additive polymer comprising a unit formed from a monomer of the following general formula (II): or (III):

wherein: R 10 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 11 is chosen from optionally substituted C1 to C15 alkyl; X 2 is oxygen, sulfur or is represented by the formula NR 12 , wherein R 12 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and Z 3 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —NHSO 2 —, —COO— and —CONR 13 — wherein R 13 is chosen from hydrogen and optionally substituted C1 to C10 alkyl;

wherein: R 14 is chosen from hydrogen and optionally substituted C1 to C3 alkyl; R 15 is independently chosen from optionally substituted C1 to C15 alkyl; X 3 is oxygen, sulfur or is represented by the formula NR 16 , wherein R 16 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; Z 4 is a single bond or a spacer unit chosen from optionally substituted aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S—, —COO— and —CONR 17 —, wherein R 17 is chosen from hydrogen and optionally substituted C1 to C10 alkyl; and n is an integer from 0 to 2;

a basic quencher; and

an organic solvent;

wherein the additive polymer has a lower surface energy than a surface energy of the matrix polymer, and wherein the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition; and

wherein the additive polymer comprises a unit containing a fluorine atom.

19. The photoresist overcoat composition of claim 18 , wherein the additive polymer comprises a unit containing a fluoroalcohol.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2017
From: LEE, CHOONG-BONG; CAPORALE, STEFAN J; DESISTO, JASON A; PARK, JONG KEUN; LIU, CONG; XU, CHENG-BAI; ANDES, CECILY
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 040996/0262 →