IP Library Granted Patent US 10,583,459
Granted Patent B2
US 10,583,459 · App. 14/141,488 · Granted Mar 10, 2020

Imaging three dimensional substrates using a transfer film

Inventors: Krishna Balantrapu (Cambridge, MA); Robert K. Barr (Shrewsbury, MA); Brian D. Amos (Worcester, MA)
Assignee: Rohm and Haas Electronic Materials LLC
B05D7/24G03F7/18G03F7/2018B05D2502/005
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Quick Facts
Patent No.
US 10,583,459
App. No.
14/141,488
Granted
Mar 10, 2020
Kind
B2
Abstract

Actinic radiation curable inks are selectively applied to flexible films which allow the transmission of actinic radiation and then are applied such that the side of the flexible films on which the curable inks are applied contact surfaces of three dimensional substrates. Actinic radiation is applied to the flexible films which cause the ink to cure on the three dimensional substrate. The flexible films are removed leaving the cured ink on the substrates.

Claims (16)

1. A method comprising:

a. selectively inkjetting a 100% solids hot melt resist composition comprising one or more waxes, one or more acrylate functional monomers free of acid groups and one or more radical photoinitiators adjacent a first surface of an actinic radiation transparent flexible film to form a continuous pattern on the first surface of the actinic radiation transparent flexible film;

b. applying the actinic radiation transparent flexible film with the 100% solids hot melt resist composition having the continuous pattern to a surface having irregularities of a three dimensional substrate, the first surface of the actinic radiation transparent flexible film with the 100% solids hot melt resist composition having the continuous pattern is adjacent the surface having irregularities of the three dimensional substrate, wherein the 100% solids hot melt resist composition contacts the surface having the irregularities and the actinic radiation transparent flexible film follows contours of the surface having irregularities of the three dimensional substrate;

c. applying actinic radiation to a second surface of the actinic radiation transparent flexible film opposite the first surface with the 100% solids hot melt resist composition having the continuous pattern to cure the 100% solids hot melt resist composition, wherein the second surface of the actinic radiation transparent flexible film is free of the 100% solids hot melt resist composition; and

d. separating the actinic radiation transparent flexible film from the cured 100% solids hot melt resist composition having the continuous pattern with the cured 100% solids hot melt resist composition having the continuous pattern adhering to the surface having irregularities of the three dimensional substrate.

2. The method of claim 1 , further comprising etching sections of the three dimensional substrate not covered with the cured 100% solids hot melt resist composition having the continuous pattern.

3. The method of claim 2 , further comprising plating metal on etched sections of the three dimensional substrate not covered with the cured 100% solids hot melt resist composition having the continuous pattern.

4. The method of claim 1 , further comprising stripping the cured 100% solids hot melt resist composition from the surface having irregularities of the three dimensional substrate with a base having a pH of 8 or greater.

5. The method of claim 1 , wherein the actinic radiation transparent flexible film is a polymer chosen from polyvinyl alcohols, polyesters, polyethylene terephthalates, polyimides, polyolefins, polycarbonates, polyacrylates and ethylvinylacetates.

6. The method of claim 1 , wherein the one or more acrylate functional monomers free of acid groups are chosen from non-aromatic cyclic (alkyl)acrylates.

7. The method of claim 6 , wherein the non-aromatic cyclic (alkyl)acrylates are chosen from monocyclic, bicyclic, tricyclic and tetracyclic alicyclic (alkyl)acrylates having a bridged skeleton and alicyclic hydrocarbon groups without a bridged skeleton.

8. The method of claim 1 , wherein the 100% solids hot melt resist composition comprises an acid number of 0-170 mg KOH/g.

9. The method of claim 1 , wherein the one or more waxes are chosen from candelilla waxes, paraffin waxes, esterified montan waxes, ozokerite waxes, ceresin waxes, synthesized hydrocarbon waxes, montan waxes, carboxylic acid-terminated polyethylene waxes, linear saturated aliphatic waxes having end functionalized carboxylic acid and hydrogenated waxes.

10. The method of claim 1 , wherein the three dimensional substrate with the surface having irregularities is a solid cylinder, hollow cylinder, cone, triangular shaped object, ellipse or multi-faced article.

11. The method of claim 1 , further comprising removing air between the actinic radiation transparent flexible film and the surface having irregularities of the three dimensional substrate.

12. The method of claim 1 , wherein the actinic radiation transparent flexible film is free of release agents.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2015
From: BALANTRAPU, KRISHNA; BARR, ROBERT K; AMOS, BRIAN D
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 036076/0216 →
Continuity (1)
Related Publication 20150182997A1 · Jul 2, 2015