Electrolytic copper plating liquid and the electrolytic copper plating method
View Patent ↗Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.
1. A copper electroplating liquid comprising a source of copper ions chosen from copper sulfate, copper cyanide or copper pyrophosphate; N,N′-bis(hydroxyl methyl)urea; and compounds selected from the group consisting of:
M-SO 3 —(CH 2 ) a —S—(CH 2 ) b —SO 3 -M; (1)
M-SO 3 —(CH 2 ) a —O—CH 2 —S—CH 2 —O—(CH 2 ) b —SO 3 -M; (2)
M-SO 3 —(CH 2 ) a —S—S—(CH 2 ) b —SO 3 -M; (3)
M-SO 3 —(CH 2 ) a —O—CH 2 —S—S—CH 2 —O—(CH 2 ) b —SO 3 -M; (4)
M-SO 3 —(CH 2 ) a —S—C(═S)—S—(CH 2 ) b —SO 3 -M; and (5)
M-SO 3 —(CH 2 ) a —O—CH 2 —S—C(═S)—S—CH 2 —O—(CH 2 ) b —SO 3 -M, (6)
wherein a and b in compounds (1)-(6) are integers from 3 to 8, M is hydrogen or an alkali metal element.
2. The copper electroplating liquid of claim 1 , further comprising a leveler and a carrier.
3. The copper electroplating liquid of claim 1 , wherein the copper electroplating liquid is free of formaldehyde.
4. A method of electroplating copper comprising:
a) providing a copper electroplating liquid comprising a source of copper ions chosen from copper sulfate, copper cyanide or copper pyrophosphate; N,N′-bis(hydroxyl methyl)urea; and compounds selected from the group consisting of:
M-SO 3 —(CH 2 ) a —S—(CH 2 ) b —SO 3 -M; (1)
M-SO 3 —(CH 2 ) a —O—CH 2 —S—CH 2 —O—(CH 2 ) b —SO 3 -M; (2)
M-SO 3 —(CH 2 ) a —S—S—(CH 2 ) b —SO 3 -M; (3)
M-SO 3 —(CH 2 ) a —O—CH 2 —S—S—CH 2 —O—(CH 2 ) b —SO 3 -M; (4)
M-SO 3 —(CH 2 ) a —S—C(═S)—S—(CH 2 ) b —SO 3 -M; and (5)
M-SO 3 —(CH 2 ) a —O—CH 2 —S—C(═S)—S—CH 2 —O—(CH 2 ) b —SO 3 -M; (6)
wherein a and b in compounds (1)-(6) are integers from 3 to 8, M is hydrogen or an alkali metal element;
b) providing a base body;
c) immersing the base body in the copper electroplating liquid; and
d) electroplating copper on the base body.