Photoresist compositions
View Patent ↗Photoresists of the invention contain an added acid reaction component together with one or more resins and a photoactive component. Preferred photoresists of the invention can provide processes substrates such as microelectronic wafers with desired iso-dense bias values. Particularly preferred photoresists of the invention are chemically-amplified positive-acting resists and contain an ester-based solvent such as ethyl lactate or propylene glycol methyl ether acetate in addition to the acid reaction component.
1. A photoresist composition comprising:
i) one or more resins;
ii) one or more photoacid generator compounds; and
iii) wherein the ethyl lactoyl lactate is present in an amount of at least 0.05 weight percent base don total solids of the photoresist composition.
2. The photoresist of claim 1 wherein the photoresist comprises a solvent component that comprises ethyl lactate.
3. A method of forming a photoresist relief image comprising:
(a) applying a coating layer of a photoresist composition of claim 1 on a substrate;
(b) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.
4. An article of manufacture having on at least one surface a coating layer of the photoresist composition of claim 1 .
5. The photoresist of claim 1 wherein the photoresist comprises a solvent component that comprises propylene glycol methyl ether acetate.
6. A method of forming a photoresist relief image comprising steps of:
(a) admixing components comprising ethyl lactoyl lactate, a solvent component, one or more resins, and one or more photoacid generator compounds to provide a photoresist composition, and wherein ethyl lactoyl lactate is added to an admixture comprising a solvent component
(b) after said admixing components of step (a), adding ethyl lactoyl lactate to the admixture comprising a solvent component;
(c) after adding ethyl lactoyl lactate to the photoresist composition in step (b), applying a coating layer of the photoresist composition on a substrate;
(d) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.