IP Library Granted Patent US 12,479,938
Granted Patent B2
US 12,479,938 · App. 17/731,605 · Granted Nov 25, 2025

Polymeric resin for dielectric applications

Inventors: Colin Hayes (Hudson, MA); Michael K. Gallagher (Hopkinton, MA); Gregory Prokopowicz (Worcester, MA)
Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
C08F212/32C08F2/06C08F12/12C08F12/32C08F212/12C08G8/32H01B3/18
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Quick Facts
Patent No.
US 12,479,938
App. No.
17/731,605
Granted
Nov 25, 2025
Kind
B2
Abstract

There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.

Claims (29)

1 . A resin composition from a mixture comprising:

(a) 60-90 weight % of at least one thermosetting resin based on total non-volatiles; and

(b) 10-40 weight % of at least one aryl ether resin based on total non-volatiles, wherein the at least one thermosetting resin is an arylcyclobutene resin, and the at least one aryl ether resin is selected from the group consisting of Formula (B1)-Formula (B6)

where n=1 to 10.

2 . The resin composition of claim 1 , wherein the at least one arylcyclobutene resin comprises a polymerization product derived from a mixture comprising

(a) 10-50 mol % of one or more addition polymerizable arylcyclobutene monomers and one or more monomers selected from the group consisting of:

(b) 15-60 mol % of one or more dienophile monomers;

(c) 15-50 mol % of one or more diene monomers; and

(d) 0-10 mol % of one or more heterocycle containing monomers.

3 . The resin composition of claim 2 , wherein the one or more addition polymerizable arylcyclobutene monomers has a structure selected from the group consisting of Formula (A-1), Formula (A-2), and Formula (A-3):

where:

K 1 is a divalent group selected from the group consisting of alkyl, aryl, carbocyclic aryl, polycyclic aryl, heteroaryl, aryloxy, arylalkyl, carbonyl, ester, carboxyl, ether, thioester, thioether, tertiary amine, and combinations thereof;

K 2 is a single bond or a divalent group selected from the group consisting of alkyl, aryl, carbocyclic aryl, polycyclic aryl, heteroaryl, aryloxy, arylalkyl, carbonyl, ester, carboxyl, and ether, thioester, thioether, tertiary amine, and combinations thereof;

K 3 is a polymerizable functional group;

L 1 is a covalent bond or a multivalent linking group;

M is a substituted or unsubstituted divalent aromatic radical group, or a substituted or unsubstituted divalent heteroaromatic radical group;

R 1 -R 4 are the same or different and are independently selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkyloxy, substituted or unsubstituted aryl, substituted or unsubstituted aryloxy, akylthio, arylthiol, substituted alkyl amino, and substituted aryl amino;

R 5 -R 7 are the same or different and are independently selected from the group consisting of hydrogen, deuterium, cyano, halo, methyl, vinyl, allyl, and a substituted or unsubstituted isoprene having 1-100 carbon atoms;

x and y are the same or different and are an integer from 1 to 5, wherein when L 1 is a covalent bond, y=1.

4 . The resin composition of claim 2 , wherein the one or more dienophile monomers has a structure given by Formula (II)

where:

B is hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted aromatic, substituted or unsubstituted heteroaromatic, substituted or unsubstituted alkyloxy, or hydroxy;

R 9 -R 11 are the same or different and are independently selected from the group consisting of hydrogen, vinyl, allyl, substituted or unsubstituted isoprene having 1-100 carbon atoms, substituted or unsubstituted alkyl group having 1 to 100 carbon atoms, halogen, cyano, substituted or unsubstituted aryl group having 6 to 100 carbon atoms, substituted or unsubstituted heteroaryl group having 6 to 100 carbon atoms, and combinations thereof.

5 . The resin composition of claim 2 , wherein the one or more diene monomers has a structure given by Formula (IV)

where:

R 16 is the same or different and are independently selected from the group consisting of hydrogen and methyl; and

R 17 is the same or different and are independently selected from the group consisting of hydrogen, C 1-5 alkyl, C 1-5 alkoxy, C 1-5 thioalkyl, and C 5-12 alkenyl.

6 . The resin composition of claim 2 , wherein the one or more heterocycle containing monomers is selected from the group consisting of vinyl substituted C 3-12 heterocycles and vinyl-substituted C 3-5 heterocycles.

7 . A liquid composition comprising the resin composition of claim 1 and one or more solvents.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2023
From: PROKOPOWICZ, GREGORY; HAYES, COLIN; GALLAGHER, MICHAEL K.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 063090/0847 →
Continuity (1)
Related Publication 20230348635A1 · Nov 2, 2023
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