Metal plating compositions
View Patent ↗Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
1. A method comprising:
a) providing a composition comprising one or more sources of metal ions and one or more compounds having a formula:
R 1 -A-R 3 -A-[C(O)—R 5 —C(O)-A-R 3 -A] n -R 2 (I)
where A is —NH—; or —NH—R 6 —;
R 1 is random, alternating or block —(CHR 9 CHR 10 O) p —H, where
R 9 and R 10 are the same or different and are —H, —CH 3 , or —CH 2 CH 3 and
p is an integer from 1 to 50;
R 2 is random, alternating or block —(CHR 9 CHR 10 O) p —H; or —C(O)—R 5 —C(O)OH;
R 3 is —(CH 2 ) r —NR 4 —(CH 2 ) r —;—(CH 2 ) r —(OC 2 H 4 )—O—(CH 2 ) r —(CH 2 ) r — and
r is an integer from 1 to 8; R 4 is random, alternating or block —(CHR 9 CHR 10 O) p —;
R 5 is —(CH 2 ) q — where q is an integer from 1 to 8;
R 6 is random, alternating or block —(CHR 9 CHR 10 O) p —; and n is an integer of 1 to 10;
b) contacting a substrate with the composition; and
c) electroplating the substrate with a metal.
2. The method of claim 1 , wherein the one or more sources of metal ions provide metal ions comprising copper, tin, nickel, gold, silver, palladium, platinum, indium or mixtures thereof.
3. The method of claim 2 , wherein the metal ions are copper.
4. The method of claim 1 , wherein the substrate is an electrical device or a decorative article.
5. The method of claim 4 , wherein the electrical device is a printed wiring board.