Acidic gold alloy plating solution
View Patent ↗A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
1. An acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, between 0.05g/L and 10g/L of hexamethylene tetramine, and a glossing agent, wherein the glossing agent of said plating solution is a nitrogen atom containing compound with a carboxyl group or a hydroxyl group, or a sulfur atom containing compound with a carboxyl group.
2. The acidic gold alloy plating solution according to claim 1 , wherein the glossing agent is at least one compound selected from a group consisting of alkanolamines, dialkanolamines, trialkanolamines, amino acids, pyridine carboxylic acid, and thiocarboxylic acid.
3. The acidic gold alloy plating solution according to claim 1 , wherein the pH of the plating solution is in a range between 3 and 6.
4. The acidic gold alloy plating solution according to claim 1 , wherein the chelating agent is a compound containing a carboxyl group.
5. The acidic gold alloy plating solution according to claim 1 , wherein the hexamethylene tetramine is between 0.1 g/L and 5 g/L.
6. The acidic gold alloy plating solution according to claim 1 , wherein the glossing agent ranges between 0.01 g/L to 50 g/L.
7. The acidic gold alloy plating solution according to claim 6 , wherein the glossing agent ranges between 0.1 g/L to 10 g/L.
8. A method of forming a gold alloy plating film by electrolytic plating comprising, a) providing an acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, between 0.05g/L and 10g/L of hexamethylene tetramine, and a nitrogen atom containing compound with a carboxyl group or a hydroxyl group, or a sulfur atom containing compound with a carboxyl group; and b) electrolytic plating the gold alloy plating film onto an electronic component at a current density of 10 A/dm 2 to 70 A/dm 2 .
9. The method according to claim 8 , wherein the pH of the plating solution is in a range between 3 and 6.
10. A method of manufacturing a connector formed with a gold alloy plating film, comprising:
performing nickel plating on the contact region of the connector; and performing gold alloy plating on the nickel plating; wherein said gold alloy plating is electrolytic plating at a current density of 10 A/dm 2 to 70 A/dm 2 and using an acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, between 0.05g/L and 10g/L of hexamethylene tetramine, and a nitrogen atom containing compound with a carboxyl group or a hydroxyl group, or a sulfur atom containing compound with a carboxyl group.
11. The method of claim 10 , wherein the current density is from 30 A/dm 2 to 50 A/dm 2 .