IP Library Granted Patent US 9,868,820
Granted Patent B2
US 9,868,820 · App. 14/472,429 · Granted Jan 16, 2018

Polyarylene materials

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Quick Facts
Patent No.
US 9,868,820
App. No.
14/472,429
Granted
Jan 16, 2018
Kind
B2
Abstract

Certain polyarylene oligomers having improved solubility are useful in forming dielectric material layers in electronics applications.

Claims (13)

1. An oligomer comprising as polymerized units a first monomer comprising two cyclopentadienone moieties, a second monomer having the formula (1), and a third monomer having the formula (2)

wherein a is the number of R groups and is an integer from 0 to 4; b is 1 or 2; each R is independently chosen from C 1-4 alkyl, halo C 1-4 alkyl, C 1-4 alkoxy, C 1-4 aralkyl, and optionally substituted C 6-10 aryl; each R 1 is independently H or optionally substituted C 6-10 aryl; R 2 is H, optionally substituted C 1-10 alkyl, optionally substituted C 7-12 aralkyl, optionally substituted C 6-10 aryl, or R 3 ; and R 3 is a polar moiety selected from the group consisting of carboxyl, C 2-12 aliphatic carboxylate, hydroxy C 1-10 alkyl, C 7-20 aryl carboxylic acid, C 8-20 aryl carboxylic acid anhydride, C 7-20 aryl carboxylates, C 7-20 aryl amide, and C 8-20 aryl imide.

2. The oligomer of claim 1 wherein the third monomer is selected from the group consisting of propiolic acid, acetylene dicarboxylic acid, phenyl propiolic acid, ethynyl benzoic acid, ethynyl phthalic acid, propargyl alcohol, 2-methyl-3-butyn-2-ol, xylityl propiolate, ethynyl phthalic anhydride, ethynyl phthalimide, ethynyl benzamide, 2-butyn-1,4-diol diacetate; 3-butyn-2-one; 1-ethynyl-1-cyclohexanol; 1-ethynylcyclohexylamine; 1-ethnylcyclopentanol; ethynylaniline; N-(ethynylphenyl)acetamide; 2-carbamoyl-5-ethynylbenzoic acid; ethynyl-nitrobenzene; propioamaide; N-hydroxyl -propiolamide; 2-aminobut-3-ynoic acid, and mixtures thereof.

3. The oligomer of claim 1 wherein the first monomer and the second monomer are present in a mole ratio of from 1:1.001 to 1:1.95.

4. The oligomer of claim 1 wherein the first monomer has the formula

wherein each R 4 is independently chosen from H, or optionally substituted phenyl; and Ar 1 is an aromatic moiety.

5. The oligomer of claim 1 wherein b=1.

6. The oligomer of claim 5 further comprising another second monomer wherein b=2.

7. A composition comprising the oligomer of claim 1 and an organic solvent.

8. The composition of claim 7 wherein the organic solvent is chosen from propylene glycol methyl ether, propylene glycol methyl ether acetate, methyl 3-methoxypropionate, ethyl lactate, anisole, N-methyl pyrrolidone, gamma-butyrolactone, ethoxybenzene, benzyl propionate, and mixtures thereof.

9. A method of forming a dielectric material layer comprising: disposing a layer of the composition of claim 7 on a substrate surface; removing the organic solvent; and curing the oligomer to form a dielectric material layer.

10. An oligomer comprising as polymerized units a first monomer comprising two cyclopentadienone moieties, a second monomer having the formula (1), and a third monomer having the formula (2)

wherein a is the number of R groups and is an integer from 0 to 4; b is 1 or 2; each R is independently chosen from C 1-4 alkyl, halo C 1-4 alkyl, C 1-4 alkoxy, C 1-4 aralkyl, and optionally substituted C 6-10 aryl; each R 1 is independently H or optionally substituted C 6-10 aryl; R 2 is H, optionally substituted C 1-10 alkyl, optionally substituted C 7-12 aralkyl, optionally substituted C 6-10 aryl, or R 3 ; and R 3 is a a hydrocarbyl moiety having from 1 to 20 carbon atoms and one or more functional groups chosen from —C(O)—, —NO 2 , and —NR 9 R 10 , where R 9 and R 10 are independently chosen from H, C 1-10 alkyl, C 7-16 aralkyl, and C 6-10 aryl.

Assignments (8)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
CHANGE OF NAME Recorded Oct 17, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD
To: DUPONT SPECIALTY MATERIALS KOREA LTD
Reel/Frame 069185/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2017
From: KANG, YERANG
To: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Reel/Frame 044221/0293 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2017
From: GILMORE, CHRISTOPHER D.; BU, LUJIA; CHUANG, PENG-WEI; WANG, DEYAN; DING, PING; KIM, YOUNG SEOK; O'CONNELL, KATHLEEN M.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 044221/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2015
From: KANG, YERANG
To: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD
Reel/Frame 036276/0211 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2015
From: GILMORE, CHRISTOPHER D; BU, LUJIA; CHUANG, PENG-WEI; WANG, DEYAN; DING, PING; KIM, YOUNG SEOK; O'CONNELL, KATHLEEN M
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 036276/0005 →