Adhesion promoter
View Patent ↗Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
1. A composition comprising: a hydrolyzed amino-alkoxysilane having a protected amino moiety; water; and organic solvent.
2. The composition of claim 1 further comprising an oligomer chosen from polyarylene oligomers, poly(cyclic-olefin) oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof.
3. A process for manufacturing an electronic device, comprising:
providing an electronic device substrate having a surface to be coated;
treating the surface to be coated with the composition of claim 2 ; and
curing the oligomer.
4. The composition of claim 1 wherein the composition further comprises a metal passivation agent.
5. The composition of claim 1 wherein the protected amino moiety is cleavable with heat, acid or a combination thereof.
6. The composition of claim 1 wherein the hydrolyzed amino-alkoxysilane is a hydrolyzed amino-poly(alkoxysilane).
7. The composition of claim 6 wherein the hydrolyzed amino-poly(alkoxysilane) has the formula:
wherein each R is independently chosen from (C 1 -C 6 )alkylidene, (C 1 -C 6 )alkylene, (C 6 -C 10 )arylene, and (C 2 -C 6 )alkenylene; each R 1 is independently chosen from H, (C 1 -C 6 )alkyl and (C 1 -C 6 )acyl; each Z is independently chosen from (C 1 -C 6 )alkyl, (C 2 -C 6 )alkenyl and —OR 1 ; and Y=an amine protecting group; wherein each R is optionally substituted with one or more of —(C 1 -C 6 )alkylidene-SiZ 2 (OR 1 ) and —(C 1 -C 6 )alkylene-SiZ 2 (OR 1 ), and wherein at least one R 1 is H.
8. The composition of claim 1 wherein the hydrolyzed amino-alkoxysilane has the formula:
wherein R is independently chosen from (C 1 -C 6 )alkylidene, (C 1 -C 6 )alkylene, (C 6 -C 10 )arylene, and (C 2 -C 6 )alkenylene; R 1 is independently chosen from H, (C 1 -C 6 )alkyl and (C 1 -C 6 )acyl; R 2 is chosen from H, —R—SiZ 2 (OR 1 ), (C 1 -C 6 )alkyl, (C 6 -C 10 )aryl and (C 7 -C 15 )alkaryl; each Z is independently chosen from (C 1 -C 6 )alkyl, (C 2 -C 6 )alkenyl and —OR 1 ; and Y=an amine protecting group; wherein each R is optionally substituted with one or more of —(C 1 -C 6 )alkylidene-SiZ 2 (OR 1 ) and —(C 1 -C 6 )alkylene-SiZ 2 (OR 1 ), and wherein at least one R 1 is H.
9. The composition of claim 1 wherein the protected amino moiety is chosen from 9-fluorenylmethyl carbamate, t-butyl carbamate, benzyl carbamate, acetamide, trifluoroacetamide, benzylamine, tritylamine, benzylideneamine, and tosylamide.
10. A process for manufacturing an electronic device, comprising:
providing an electronic device substrate having a surface to be coated;
treating the surface to be coated with the composition of claim 1 ;
disposing a coating composition comprising an oligomer chosen from polyarylene oligomers, poly(cyclic-olefin) oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof on the treated surface; and
curing the coating composition.