Adhesion promoter
View Patent ↗Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.
1. A process for manufacturing a device, comprising:
providing a device substrate having a surface to be coated;
treating the surface to be coated with an adhesion promoting composition comprising an poly(alkoxysilane) having from 2 to 6 alkoxysilane moieties and a solvent, wherein the poly(alkoxysilane) is hydrolyzed with ≦1 mole % of water, and wherein the composition comprises ≦1 mole % of alcohol of hydrolysis; and
disposing a coating composition comprising an oligomer chosen from polyarylene oligomers, poly(cyclic-olefin) oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof on the treated surface.
2. The process of claim 1 wherein the device substrate is an electronic device substrate.
3. The process of claim 2 wherein the electronic device substrate comprises a surface comprising one or more of silicon, glass, ceramic, and metal.
4. The process of claim 1 wherein the poly(alkoxysilane) prior to being hydrolyzed has the formula:
wherein each R is independently chosen from (C 1 -C 6 )alkylidene, (C 1 -C 6 )alkylene, (C 6 -C 10 )arylene, and (C 2 -C 6 )alkenylene; each R 1 is independently chosen from H, (C 1 -C 6 )alkyl and (C 1 -C 6 )acyl; each Z is independently chosen from (C 1 -C 6 )alkyl, (C 2 -C 6 )alkenyl and —OR 1 ; X═(C 6 -C 10 )arylene, O, S, S—S, S—S—S, S—S—S—S, N(Y), P(Y), or a covalent bond; Y═H, (C 1 -C 6 )alkyl, (C 1 -C 6 )alkylene-N(Y 1 ) 2 , (C 2 -C 6 )alkenyl, (C 1 -C 6 )alkylene-Si(Z) 2 (OR 1 ), or aryl(meth)acryloyl; and Y 1 ═H, (C 1 -C 6 )alkyl, or (C 2 -C 6 )alkenyl; wherein each R is optionally substituted with one or more of (C 1 -C 6 )alkylidene-Si(Z) 2 (OR 1 ) and (C 1 -C 6 )alkylene-Si(Z) 2 (OR 1 ).
5. The process of claim 1 wherein the poly(alkoxysilane) is hydrolyzed with ≦0.5 mole % of water.
6. The process of claim 1 wherein the arylcyclobutane oligomer has the formula:
wherein B is an n-valent linking group; Ar is a polyvalent aryl group and the carbon atoms of the cyclobutene ring are bonded to adjacent carbon atoms on the same aromatic ring of Ar; m is an integer of 1 or more; n is an integer of 1 or more; and R 5 is a monovalent group.
7. The process of claim 1 wherein the adhesion promoting composition has a mean particle size of ≦1 nm, as determined by dynamic light scattering.
8. The process of claim 1 further comprising a step of solvent removal after the treating step and before the step of disposing the coating composition.
9. A process for manufacturing a device, comprising:
providing a device substrate having a surface to be coated;
treating the surface to be coated with an adhesion promoting composition comprising an poly(alkoxysilane) and a solvent, wherein the poly(alkoxysilane) is hydrolyzed with ≦1 mole % of water, and wherein the composition comprises ≦1 mole % of alcohol of hydrolysis; and
disposing a coating composition comprising an oligomer chosen from polyarylene oligomers, poly(cyclic-olefin) oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof on the treated surface;
wherein the poly(alkoxysilane) prior to being hydrolyzed has the formula:
wherein each R is independently chosen from (C 1 -C 6 )alkylidene, (C 1 -C 6 )alkylene, (C 6 -C 10 )arylene, and (C 2 -C 6 )alkenylene; each R 1 is independently chosen from H, (C 1 -C 6 )alkyl and (C 1 -C 6 )acyl; each Z is independently chosen from (C 1 -C 6 )alkyl, (C 2 -C 6 )alkenyl and —OR 1 ; X═(C 6 -C 10 )arylene, O, S, S—S, S—S—S, S—S—S—S, N(Y), P(Y), or a covalent bond; Y═H, (C 1 -C 6 )alkyl, (C 1 -C 6 )alkylene-N(Y 1 ) 2 , (C 2 -C 6 )alkenyl, (C 1 -C 6 )alkylene-Si(Z) 2 (OR 1 ), or aryl(meth)acryloyl; and Y 1 ═H, (C 1 -C 6 )alkyl, or (C 2 -C 6 )alkenyl; wherein each R is optionally substituted with one or more of (C 1 -C 6 )alkylidene-Si(Z) 2 (OR 1 ) and (C 1 -C 6 )alkylene-Si(Z) 2 (OR 1 ).
10. The process of claim 9 wherein the device substrate is an electronic device substrate.
11. The process of claim 10 wherein the electronic device substrate comprises a surface comprising one or more of silicon, glass, ceramic, and metal.
12. The process of claim 9 wherein the poly(alkoxysilane) is hydrolyzed with ≦0.5 mole % of water.
13. The process of claim 9 wherein the arylcyclobutane oligomer has the formula:
wherein B is an n-valent linking group; Ar is a polyvalent aryl group and the carbon atoms of the cyclobutene ring are bonded to adjacent carbon atoms on the same aromatic ring of Ar; m is an integer of 1 or more; n is an integer of 1 or more; and R 5 is a monovalent group.
14. The process of claim 9 wherein the adhesion promoting composition has a mean particle size of ≦1 nm, as determined by dynamic light scattering.
15. The process of claim 9 further comprising a step of solvent removal after the treating step and before the step of disposing the coating composition.
16. A process for manufacturing a device, comprising:
providing a device substrate having a surface to be coated;
treating the surface to be coated with an adhesion promoting composition comprising an poly(alkoxysilane) and a solvent, wherein the poly(alkoxysilane) is hydrolyzed with ≦1 mole % of water, and wherein the composition comprises ≦1 mole % of alcohol of hydrolysis; and
disposing a coating composition comprising an oligomer chosen from polyarylene oligomers, poly(cyclic-olefin) oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof on the treated surface;
wherein the adhesion promoting composition has a mean particle size of ≦1 nm, as determined by dynamic light scattering.