Metal plating compositions and methods
View Patent ↗Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
1. Compounds having a formula:
H-A′ p -Q-[C(O)—CH 2 O—((R 1 CH) t —O) z —CH 2 —C(O)—NH-A] u —H (I)
where A′ is —(NH—(CH 2 ) x′ ) y′ —; —NH(CH 2 ) x′ —(O—(CHR 1 ) r′ ) w′ —O—(CH 2 ) x′ —; or —NH—((R 1 CH) r′ —O) w′ —C 2 H 4 —;
A is —((CH 2 ) x —NH) y —; —(CH 2 ) x —(O—(CHR 1 ) r ) w —O—(CH 2 ) x —NH—; or —((R 1 CH) r —O) w —C 2 H 4 —NH—;
R 1 is —H or —CH 3 ,
Q is —NH— when p=1 or —O— when p=0,
p is 0 or 1, wherein H— and Q form a chemical bond when p=0,
r′ is an integer from 2 to 4,
w′ is an integer from 1 to 50,
x′ is an integer from 2 to 6,
y′ is an integer from 0 to 5,
wherein H— and Q form a chemical bond when y′ is 0,
r is an integer from 2 to 4,
w is an integer from 1 to 50,
x is an integer from 2 to 6,
y is an integer from 0 to 5, wherein H— is bonded to the nitrogen of terminal —C(O)—NH— when y is 0,
t is an integer from 2 to 4,
u is an integer from 1 to 20,
w is an integer from 1 to 50, and
z is an integer from 1 to 50.