Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
View Patent ↗Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
1. A method comprising:
a) providing a substrate comprising a metal layer;
b) contacting the substrate with an indium electroplating composition comprising one or more sources of indium ions, one or more 1,10-phenanthroline compounds in amounts of 0.1 ppm to 15 ppm and citric acid, salt of citric acid or mixtures thereof; and
c) electroplating an indium metal layer on the metal layer of the substrate with the indium electroplating composition.
2. The method of claim 1 , wherein the indium electroplating composition further comprises one or more sources of chloride ions, wherein a molar ratio of the chloride ions to the indium ions is 2:1 or greater.
3. The method of claim 1 , wherein the metal layer is nickel, copper, gold or tin.
4. The method of claim 3 , wherein the metal layer is nickel.
5. The method of claim 1 , wherein the metal layer is 10 nm to 100 μm thick.
6. The method of claim 1 , wherein the indium metal layer is 10 nm to 100 μm thick.