Method for replenishing tin and its alloying metals in electrolyte solutions
View Patent ↗Methods are disclosed for replenishing tin and its alloying metals in an aqueous electrolytic plating bath using an acidic solution containing stannous oxide. During electroplating of tin or tin alloys the stannous ions and alloying metal ions are depleted. To maintain continuous and efficient electroplating processes predetermined amounts of the plating bath containing tin and its alloying metals are bailed out. The bail out is then mixed with a predetermined amount of acidic solution containing stannous oxide and any alloying metals. The mixture is then retuned to the plating bath to return the stannous ions and alloying metal ions to their steady state concentrations.
1. A method comprising:
a) providing an electrolytic cell comprising an insoluble anode and a cathode;
b) introducing a composition comprising one or more sources of stannous ions and one or more sources of silver ions, free acid in amounts of 0.05 g/L to 5 g/L one or more acid electrolytes or salts thereof into the electrolytic cell;
c) electrically connecting the insoluble anode and the cathode and generating a current flow at a current density effective to deposit tin/silver alloy on the cathode; and increasing the free acid concentration of the composition;
d) removing a predetermined amount of the composition comprising the increased free acid from the electrolytic cell by flowing the predetermined amount of the composition comprising the increased free acid concentration to a reservoir in fluid communication to the electrolytic cell;
e) adding a predetermined amount of a solution, formed by the addition of stannous oxide in amounts of 5 g/L to 100 g/L, so as to provide tin ions and one or more sources of silver ions to provide silver ions in amounts of 0.01 g/L to 10 g/L to the composition comprising the increased free acid concentration in the reservoir to form a mixture; and
f) feeding the mixture into the electrolytic cell.
2. The method of claim 1 , wherein the electroplating composition further comprises one or more complexing agents.
3. The method of claim 2 , wherein the one or more complexing agents are chosen from thiols and thials.
4. The method of claim 1 , wherein the one or more acid electrolytes are chosen from alkane sulfonic acids, arylsulfonic acids, sulfuric acid, sulfamic acid, hydrochloric acid, fluoroboric acid and salts thereof.
5. The mthod of claim 1 , wherein the cathode comprise copper, copper alloys, nickel, nickel alloys, plastics or silicon wafers.