IP Library Granted Patent US 8,455,175
Granted Patent B2
US 8,455,175 · App. 13/094,629 · Granted Jun 4, 2013

Photosensitive composition

Inventors: Mark R. Winkle (Lansdale, PA); Jill E. Steeper (Melrose, MA); Xiang-Qian Liu (Norristown, PA); Janet Okada-Coakley (Boylston, MA); Scott A. Ibbitson (Trappe, PA)
Assignee: Rohm and Haas Electronic Materials LLC
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Quick Facts
Patent No.
US 8,455,175
App. No.
13/094,629
Granted
Jun 4, 2013
Kind
B2
Abstract

Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.

Claims (17)

1. A photosensitive composition, comprising:

a binder polymer prepared by free radical polymerization of acrylic acid and/or methacrylic acid with one or more monomers chosen from acrylate monomers, methacrylate monomers and vinyl aromatic monomers;

a free radical polymerizable monomer bearing two or more ethylenically unsaturated groups,

a free radical photoinitiator; and

a stable free radical inhibitor, wherein the stable free radical inhibitor is present in the composition in an amount of from 0.04 to 0.3 wt % based on the total weight of the composition;

wherein the composition has a total solids content of 45 wt % or greater, and

wherein the composition is capable of being coated to a dried thickness of greater than 50 microns by spin coating in a single application.

2. The photosensitive composition of claim 1 , wherein the composition is capable of being coated to a dried thickness of greater than 100 microns by spin coating in a single application.

3. The photosensitive composition of claim 1 , wherein the binder polymer is prepared by free radical polymerization of ethyl acrylate, methyl methacrylate, and methacrylic acid.

4. The photosensitive composition of claim 1 , wherein the stable free radical inhibitor comprises 2,2,6,6-tetramethyl-1-piperidinyloxy, 2,2-diphenyl-1-picrylhydrazyl, or a derivative thereof.

5. A dry-film photoresist, comprising:

a releasable carrier substrate; and

a photosensitive layer over the carrier substrate, comprising the photosensitive composition of claim 1 .

6. The dry-film photoresist of claim 5 , wherein the binder polymer is prepared by free radical polymerization of ethyl acrylate, methyl methacrylate, and methacrylic acid.

7. The dry-film photoresist of claim 5 , wherein the stable free radical inhibitor comprises 2,2,6,6-tetramethyl-1-piperidinyloxy, 2,2-diphenyl-1-picrylhydrazyl, or a derivative thereof.

8. The photosensitive composition of claim 4 , wherein the stable free radical inhibitor comprises 2,2,6,6-tetramethyl-1-piperidinyloxy.

9. The photosensitive composition of claim 4 , wherein the stable free radical inhibitor comprises 2,2-diphenyl-1-picrylhydrazyl.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
Continuity (3)
Continuation 11594551 · Nov 8, 2006
Provisional Application 60734599 · Nov 8, 2005
Related Publication 20110262861A1 · Oct 27, 2011