Method of enhancing copper electroplating

1. A method comprising:

a) providing a substrate comprising copper;

b) applying a composition to the copper of the substrate to increase exposed copper grains having crystal plane (111) orientations, wherein the composition consists of water, a crystal plane (111) orientation enrichment compound in amounts of at least 0.01M, wherein the crystal plane (111) orientation enrichment compound is selected from a quaternary amine, a metal ion selected from the group consisting of cerium (IV), titanium (IV), iron (III), manganese (IV), manganese (VI), manganese (VII), vanadium (III), vanadium (V), nickel (II), nickel (IV), cobalt (III), molybdenum (IV), gold (I), palladium (II), platinum (II), iridium (I), germanium (II), bismuth (III), and mixtures thereof, wherein the metal ion is at a concentration of 1 ppm or greater, counter anions of the metal ions, a pH of 12-14, optionally a pH adjusting agent, and optionally a surfactant; and

c) electroplating copper on the copper having the increased exposed copper grains having crystal plane (111) orientations with a copper electroplating bath.

2. The method of claim 1 , wherein the quaternary amine has the formula:

wherein R 1 -R 4 are independently chosen from hydrogen, C 1 -C 4 alkyl and benzyl with the proviso that up to three of R 1 -R 4 can be hydrogen at the same instance.

3. The method of claim 2 , wherein the quaternary amine is are selected from the group consisting of tetramethylammonium hydroxide, benzyltrimethylammonium hydroxide and triethylammonium hydroxide.

4. The method of claim 1 , wherein the crystal plane (111) orientation enrichment compound is in amounts of 0.01M to 5M.

5. The method of claim 1 , wherein the metal ion is at a concentration of 1 ppm to 100 ppm.

6. The method of claim 1 , wherein the pH is from 13-14.