IP Library Granted Patent US 11,296,436
Granted Patent B2
US 11,296,436 · App. 16/871,340 · Granted Apr 5, 2022

Press-fit terminal with improved whisker inhibition

Inventor: Flora He (Fanling, HK)
Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
H01R12/585H01R4/58H05K1/115
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Quick Facts
Patent No.
US 11,296,436
App. No.
16/871,340
Granted
Apr 5, 2022
Kind
B2
Abstract

A press-fit terminal for insertion into a conductive through-hole of a substrate includes an elastic deformation part with an outer and inner surface, the press-fit terminal includes, in sequence, a copper or copper alloy base, nickel or a nickel alloy barrier layer, a tin or tin alloy layer and an indium top layer. The press-fit terminal shows reduced whisker formation.

Claims (5)

1. A press-fit terminal to be inserted into a conductive through-hole of a printed circuit board, the press-fit terminal comprises: a first and a second elastic deformation part, the first and second elastic deformation parts are along the length of the press-fit terminal, the first and the second elastic deformation parts have an outer surface and an inner surface, the first and second elastic deformation parts are joined at one end by a guide part and at an end opposite to the guide part by a neck part, and a channel part is formed between the first and second elastic deformation parts, the press-fit terminal comprises, in sequence, a copper or copper alloy base, a nickel or a nickel alloy barrier layer adjacent to the copper or copper alloy base, a tin or tin alloy layer adjacent the nickel or the nickel alloy barrier layer, wherein the tin alloy is selected from the group consisting of tin-bismuth and tin-indium, and an indium layer adjacent to the tin or tin alloy layer.

2. The press-fit terminal to be inserted into a conductive through-hole of a printed circuit board of claim 1 , wherein the nickel or nickel alloy layer has a thickness of 0.5-5 μm.

3. The press-fit terminal to be inserted into a conductive through-hole of a printed circuit board of claim 1 , wherein the tin or tin alloy layer has a thickness of 0.5-5 μm.

4. The press-fit terminal to be inserted into a conductive through-hole of a printed circuit board of claim 1 , wherein the indium layer has a thickness of 0.1-3 μm.

5. The press-fit terminal to be inserted into a conductive through-hole of a printed circuit board of claim 4 , wherein the indium layer has a thickness of 0.1-0.4 μm.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2022
From: HE, FLORA
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 058786/0820 →
Cited By (1)
US 12,683,312