IP Library Granted Patent US 9,063,425
Granted Patent B2
US 9,063,425 · App. 13/671,528 · Granted Jun 23, 2015

Topcoat compositions and photolithographic methods

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Quick Facts
Patent No.
US 9,063,425
App. No.
13/671,528
Granted
Jun 23, 2015
Kind
B2
Abstract

Topcoat compositions are provided that can be used in immersion lithography to form photoresist patterns. The topcoat compositions include a polymer system that includes a matrix polymer and a surface active polymer. The matrix polymer is present in the composition in a larger proportion by weight than the surface active polymer, and the surface active polymer has a lower surface energy than a surface energy of the matrix polymer. A solvent system includes a first organic solvent chosen from gamma-butyrolactone and/or gamma-valerolactone, and a second organic solvent. The first organic solvent has a higher surface energy than a surface energy of the surface active polymer, and a higher boiling point than a boiling point of the second organic solvent.

Claims (15)

1. A method of forming a photolithographic pattern, comprising:

(a) applying a photoresist layer over a substrate;

(b) applying over the photoresist composition layer a layer of a topcoat composition, wherein the topcoat composition comprises:

a polymer system comprising a matrix polymer and a surface active polymer, wherein the surface active polymer comprises one or more acid-labile groups, wherein the matrix polymer is present in the composition in a larger proportion by weight than the surface active polymer, and wherein the surface active polymer has a lower surface energy than a surface energy of the matrix polymer, and wherein a layer of the topcoat composition in a dried state has a water receding contact angle of from 80.2 to 85° ; and

a solvent system comprising a first organic solvent chosen from gamma-butyrolactone and/or gamma-valerolactone, and a second organic solvent,

wherein the first organic solvent has a higher surface energy than a surface energy of the surface active polymer; and

wherein the first organic solvent has a higher boiling point than a boiling point of the second organic solvent;

(c) exposing the photoresist layer to actinic radiation; and

(d) contacting the exposed photoresist layer with a developer to form a photoresist pattern.

2. The method of claim 1 , wherein the first organic solvent is gamma-butyrolactone.

3. The method of claim 1 , wherein the first organic solvent is gamma-valerolactone.

4. The method of claim 1 , wherein the first organic solvent is present in an amount of from 1 to 10 wt % based on the solvent system.

5. The method of claim 1 , wherein the first organic solvent has a higher boiling point than a boiling point of the second organic solvent and any other solvent in the topcoat composition.

6. The method of claim 1 , wherein the second organic solvent is chosen from alcohols, alkyl ethers, alkanes and combinations thereof.

7. The method of claim 1 , wherein the surface active polymer comprises one or more fluorinated groups.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2015
From: WANG, DEYAN
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 035681/0624 →