IP Library Granted Patent US 12,637,560
Granted Patent B2
US 12,637,560 · App. 18/187,201 · Granted May 26, 2026

Resin composition

Inventors: Colin Hayes (Hudson, MA); Anton Chavez (West Newton, MA); Nora Sabina Radu (Ladenberg, PA); Jaclyn Murphy (Ashland, MA); Qing Min Wang (North Andover, MA); Tao Huang (Stow, MA); Anton Li (Marlborough, MA); Tanya N. Singh-Rachford (South Grafton, MA); Michael Gallagher (Hopkinton, MA)
Assignees: Dupont Electronic Materials International, LLC; DuPont Electronics, Inc.
C08L23/20C08K5/5399C08L77/10C08L79/08C08L2203/16
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,637,560
App. No.
18/187,201
Granted
May 26, 2026
Kind
B2
Abstract

There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.

Claims (20)

1 . A composition comprising:

(a) 2-20 wt. % of one or more thermosetting resins;

(b) 1-25 wt. % of one or more soluble polyimide resins;

(c) 35-80 wt. % on one or more inorganic particulate fillers; and

(d) 5-45 wt. % of one or more crosslinkers,

wherein the wt. % ranges are with respect to the total solid weight of the composition, wherein the thermosetting resins comprise at least one arylcyclobutene resin;

and the soluble polyimide resins are prepared from aromatic tetracarboxylic acid dianhydrides selected from the group consisting of 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), 4,4′-oxydiphthalic dianhydride (ODPA), 4,4′-bisphenol A dianhydride (BPADA) and 4,4′-(hexafluoro-isopropylidene) diphthalic anhydride (6FDA); and aromatic diamines selected from the group consisting of 2,2′-bis(trifluoromethyl) benzidine (TFMB) and 1,3-bis(3-aminophenoxy) benzene (APB-133).

2 . The composition of claim 1 , further comprising a solvent, wherein the solvent is 10-70 wt. % of the total composition.

3 . The composition of claim 2 , further comprising 0.5-10 wt. % of one or more adhesion promoters based on the total composition.

4 . The composition of claim 3 , wherein the one or more adhesion promoters is an organic nitrogen-containing phosphorous compound.

5 . The composition of claim 3 , further comprising one or more components selected from the group consisting of cyanate esters, allylic resins, butadiene resins, cyanurate, isocyanurate, and (meth)acrylate resins.

6 . The composition of claim 5 , wherein the one or more components comprises triallyl cyanurate and triallyl isocyanurate.

7 . The composition of claim 6 , wherein the triallyl cyanurate and triallyl isocyanurate are 5-30 wt. % of the total solid weight of the composition.

8 . The composition of claim 7 , wherein the triallyl cyanurate and triallyl isocyanurate are 20-30 wt. % of the total solid weight of the composition.

9 . The composition of claim 2 , wherein the one or more crosslinkers are maleimides.

10 . The composition of claim 9 , wherein the maleimides comprise one or more biphenyl groups.

11 . The composition of claim 10 , wherein the maleimides are 10-30 wt. % of the total solid weight of the composition.

12 . The composition of claim 11 , wherein the maleimides are 10-20 wt. % of the total solid weight of the composition.

13 . The composition of claim 2 , further comprising one or more additives selected from the group consisting of, organic fillers, plasticizers, adhesion promoters, metal passivating materials, flame retardants, and surface leveling agents.

14 . A surface-treated metallic foil, wherein at least one surface of the surface-treated metallic foil comprises a surface treatment comprising the composition of claim 2 .

Assignments (5)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2023
From: RADU, NORA SABINA; HUANG, TAU
To: DUPONT ELECTRONICS, INC.
Reel/Frame 063402/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2023
From: WANG, QING MIN; LI, ANTON; CHAVEZ, ANTON; GALLAGHER, MICHAEL; HAYES, COLIN; MURPHY, JACLYN; SINGH-RACHFORD, TANYA N.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 063402/0407 →