Phenolic polymers and photoresists comprising same

1. A method of forming a positive photoresist relief image, comprising:

(a) applying on a substrate a layer of a photoresist comprising a photoactive component and a resin, the resin comprises a structure of the following formula

wherein each Z is the same or different bridge unit;

X comprises one or more alkyl, oxygen or sulfur atoms;

each R 1 is the same or different non-hydrogen substituent; and m is an integer of from zero to 4;

AL is a moiety that comprises a photoacid-labile group;

Y is a moiety that is distinct from the spaced phenolic group or moiety that comprises AL, and Y is selected from the group consisting of phenyl; phenyl substituted with halogen, cyano, alkyl or alkoxy; and an ester that does not undergo a photoacid-indueed cleavage reaction during exposing and developing of the photoresist layer;

a, b and c are mole percents of the respective polymer units based on total repeat units in the polymer and a, b and c are each greater than zero; and

(b) exposing and developing the photoresist layer to yield a relief image.

2. The method of claim 1 wherein X consists essentially of one or more alkyl or oxygen atoms.

3. The method of claim 1 wherein the resin comprises a structure of the following formula

each R is the same or different and is hydrogen or optionally substituted alkyl;

each Z is the same or different bridge unit;

X comprises one or more alkyl, oxygen or sulfur atoms;

each R 1 is the same or different non-hydrogen substituent;

m is an integer of from zero to 4;

P is a moiety that provides a photoacid-labile ester;

Y is a moiety that is distinct from the spaced phenolic group or moiety that comprises P, and Y is selected from the group consisting of phenyl; phenyl substituted with halogen, cyano, alkyl or aikoxy; and an ester that does not undergo a photoacid-induced cleavage reaction during exposing and developing of the photoresist layer; and

a, b and c are mole percents of the respective polymer units based on total repeat units in the polymer and are each greater than zero.

4. The method of claim 3 wherein X consists essentially of one or more alkyl or oxygen atoms.

5. The method of claim 1 wherein the resin comprises polymerized units of hydroxyphenylmethacrylate; methyl methacrylate; and tert-butyl acrylate.

6. The method of claim 1 wherein the resin comprises polymerized units of hydroxyphenylmethacrylate; styrene; and tert-butyl acrylate.

7. The method of claim 1 wherein ions are applied to the substrate after the photoresist relief image is formed.