Cholate photoacid generators and photoresists comprising same
New photoacid generator compounds (“PAGs”) are provided that comprise a cholate moiety and photoresist compositions that comprise such PAG compounds.
1. A photoacid generator compound of the following formula (III):
(R)—X—(C═O)O(CH 2 ) m (CWY) n SO 3 M + (III)
wherein R is a steroid structure,
X is a linker;
W and Y are each independently in each occurrence hydrogen or fluoro;
M + represent an organic onium group;
m is an integer of 1 to 10;
n is 2.
2. A photoacid generator compound of the following formula (IV):
(R)—X—O(C═O)(CH 2 ) m (CWY) n SO 3 M + (IV)
wherein R is a steroid structure,
X is a linker;
W and Y are each independently in each occurrence hydrogen or fluoro;
M + represent an organic onium group;
m is an integer of 1 to 10;
n is a positive integer.
3. A photoacid generator compound selected from:
wherein in each structure, m is an integer from 1 to 10, n is 2, M + represents an organic onium group, and the definition of the group R, is defined directly below the respective structure.
4. A photoresist composition comprising a resin component and a photoacid generator compound of claim 1 .
5. A photoresist composition comprising a resin component and a photoacid generator compound of claim 2 .
6. A photoresist composition comprising a resin component and a photoacid generator compound of claim 3 .
7. A method for forming a photoresist relief image comprising:
(a) applying a coating layer of a photoresist composition of claim 4 on a substrate;
(b) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.
8. A method for forming a photoresist relief image comprising:
(a) applying a coating layer of a photoresist composition of claim 5 on a substrate;
(b) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.
9. A method for forming a photoresist relief image comprising:
(a) applying a coating layer of a photoresist composition of claim 6 on a substrate;
(b) exposing the photoresist coating layer to patterned activating radiation and developing the exposed photoresist layer to provide a relief image.